Lawrence W. Golick

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Allentown, PA, US

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Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing an electronic device package
- Patent number 8,869,389
- Issue date Oct 28, 2014
- LSI Corporation
- Larry Golick
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame design to improve reliability
- Patent number 8,334,467
- Issue date Dec 18, 2012
- LSI Corporation
- Larry W. Golick
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Patents Applicationslast 30 patents

Information Patent Application
Systems and Methods for Main Distribution on an Integrated Circuit
- Publication number 20160260662
- Publication date Sep 8, 2016
- Avago Technologies General IP (Singapore) PTE. LTD.
- Donald E. Hawk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME DESIGN TO IMPROVE RELIABILITY
- Publication number 20130067743
- Publication date Mar 21, 2013
- LSI Corporation
- Larry Golick
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME DESIGN TO IMPROVE RELIABILITY
- Publication number 20100319987
- Publication date Dec 23, 2010
- LSI Corporation
- Larry W. Golick
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Process for fabricating a power hybrid module
- Publication number 20040212081
- Publication date Oct 28, 2004
- Patrick J. Carberry
- H01 - BASIC ELECTRIC ELEMENTS