Laxminarayan Sharma

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San Diego, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Conductive clip connection arrangements for semiconductor packages
- Patent number 10,490,489
- Issue date Nov 26, 2019
- Silanna Asia Pte Ltd
- Stuart B. Molin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive clip connection arrangements for semiconductor packages
- Patent number 10,128,170
- Issue date Nov 13, 2018
- Silanna Asia Pte Ltd
- Stuart B. Molin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die stacking system and method
- Patent number 9,159,694
- Issue date Oct 13, 2015
- QUALCOMM Incorporated
- Henry Sanchez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die stacking system and method
- Patent number 7,872,356
- Issue date Jan 18, 2011
- QUALCOMM Incorporated
- Hen Sanchez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging
- Patent number 7,602,050
- Issue date Oct 13, 2009
- QUALCOMM Incorporated
- Laxminarayan Sharma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for solder ball rework
- Patent number 6,574,861
- Issue date Jun 10, 2003
- Applied Micro Circuits Corporation
- Hong Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device package with high speed signal interconnect betwe...
- Patent number 6,566,761
- Issue date May 20, 2003
- Applied Micro Circuits Corporation
- Laxminarayan Sharma
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CONDUCTIVE CLIP CONNECTION ARRANGEMENTS FOR SEMICONDUCTOR PACKAGES
- Publication number 20190080989
- Publication date Mar 14, 2019
- Silanna Asia Pte Ltd
- Stuart B. Molin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE CLIP CONNECTION ARRANGEMENTS FOR SEMICONDUCTOR PACKAGES
- Publication number 20180197808
- Publication date Jul 12, 2018
- Silanna Asia Pte Ltd
- Stuart B. Molin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Packaging with Split Paddle
- Publication number 20110115063
- Publication date May 19, 2011
- ENTROPIC COMMUNICATIONS, INC.
- Laxminarayan SHARMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die Stacking System and Method
- Publication number 20110079905
- Publication date Apr 7, 2011
- QUALCOMM Incorporated
- Henry Sanchez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die stacking system and method
- Publication number 20080283993
- Publication date Nov 20, 2008
- QUALCOMM Incorporated
- Henry Sanchez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated circuit packaging
- Publication number 20070096268
- Publication date May 3, 2007
- Laxminarayan Sharma
- H01 - BASIC ELECTRIC ELEMENTS