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Patents Grantslast 30 patents

Information Patent Grant
Device thermal management
- Patent number 11,437,328
- Issue date Sep 6, 2022
- QUALCOMM Incorporated
- Peng Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-phase heat dissipating device comprising piezo structures
- Patent number 10,746,474
- Issue date Aug 18, 2020
- QUALCOMM Incorporated
- Jorge Luis Rosales
- F28 - HEAT EXCHANGE IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
DEVICE THERMAL MANAGEMENT
- Publication number 20200365522
- Publication date Nov 19, 2020
- QUALCOMM Incorporated
- Peng WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-PHASE HEAT DISSIPATING DEVICE COMPRISING PIEZO STRUCTURES
- Publication number 20190257589
- Publication date Aug 22, 2019
- QUALCOMM Incorporated
- Jorge Luis ROSALES
- F28 - HEAT EXCHANGE IN GENERAL