Leah M. Miller

Person

Fremont, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Package configuration and manufacturing method enabling the additio...
- Patent number 7,829,424
- Issue date Nov 9, 2010
- LSI Corporation
- Leah Miller
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package having discrete non-active electrical compone...
- Patent number 7,791,210
- Issue date Sep 7, 2010
- LSI Corporation
- Leah Miller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package configuration and manufacturing method enabling the additio...
- Patent number 7,508,062
- Issue date Mar 24, 2009
- LSI Corporation
- Leah Miller
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High speed interface design
- Patent number 7,414,322
- Issue date Aug 19, 2008
- LSI Corporation
- Leah M. Miller
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ball assignment system
- Patent number 7,319,272
- Issue date Jan 15, 2008
- LSI Logic Corporation
- Arun Ramakrishnan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Scaling of functional assignments in packages
- Patent number 7,298,036
- Issue date Nov 20, 2007
- LSI Corporation
- Leah M. Miller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Routing structure for transceiver core
- Patent number 7,062,742
- Issue date Jun 13, 2006
- LSI Logic Corporation
- Leah M. Miller
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Designing a ball assignment for a ball grid array package
- Patent number 7,051,434
- Issue date May 30, 2006
- LSI Logic Corporation
- Leah M. Miller
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-chip package having a contiguous heat spreader assembly
- Patent number 6,963,129
- Issue date Nov 8, 2005
- LSI Logic Corporation
- Thomas Evans
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi chip module
- Patent number 6,858,930
- Issue date Feb 22, 2005
- LSI Logic Corporation
- Leah M. Miller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging that uses guard conductors to isolate...
- Patent number 6,791,177
- Issue date Sep 14, 2004
- LSI Logic Corporation
- Leah M. Miller
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Dual clock package option
- Patent number 6,768,386
- Issue date Jul 27, 2004
- LSI Logic Corporation
- Leah M. Miller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ball assignment for ball grid array package
- Patent number 6,762,366
- Issue date Jul 13, 2004
- LSI Logic Corporation
- Leah M. Miller
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Isolated stripline structure
- Patent number 6,744,130
- Issue date Jun 1, 2004
- LSI Logic Corporation
- Leah M. Miller
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for reliability testing leakage characteristics in an electr...
- Patent number 6,701,270
- Issue date Mar 2, 2004
- LSI Logic Corporation
- Leah M. Miller
- G01 - MEASURING TESTING
Information Patent Grant
Multi chip module
- Patent number 6,680,532
- Issue date Jan 20, 2004
- LSI Logic Corporation
- Leah M. Miller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit test vehicle
- Patent number 6,534,968
- Issue date Mar 18, 2003
- LSI Logic Corporation
- Leah M. Miller
- G01 - MEASURING TESTING
Information Patent Grant
High density signal routing
- Patent number 6,459,049
- Issue date Oct 1, 2002
- LSI Logic Corporation
- Leah M. Miller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Splitting and assigning power planes
- Patent number 6,445,066
- Issue date Sep 3, 2002
- LSI Logic Corporation
- Leah M. Miller
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE CONFIGURATION AND MANUFACTURING METHOD ENABLING THE ADDITIO...
- Publication number 20080272863
- Publication date Nov 6, 2008
- LSI Logic Corporation
- Leah Miller
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Scaling of functional assignments in packages
- Publication number 20070114644
- Publication date May 24, 2007
- Leah M. Miller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High speed interface design
- Publication number 20070023930
- Publication date Feb 1, 2007
- Leah M. Miller
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Ball assignment system
- Publication number 20060223341
- Publication date Oct 5, 2006
- Arun Ramakrishnan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Package configuration and manufacturing method enabling the additio...
- Publication number 20060202303
- Publication date Sep 14, 2006
- LSI Logic Corporation
- Leah Miller
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor package having dicrete non-active electrical componen...
- Publication number 20050093173
- Publication date May 5, 2005
- LSI Logic Corporation
- Leah Miller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Routing structure for transceiver core
- Publication number 20040216071
- Publication date Oct 28, 2004
- Leah M. Miller
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Multi chip module
- Publication number 20040065951
- Publication date Apr 8, 2004
- LSI Logic Corporation
- Leah M. Miller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ball assignment for ball grid array package
- Publication number 20030183419
- Publication date Oct 2, 2003
- LSI Logic Corporation
- Leah M. Miller
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Leah M. Miller

Person

Patents Grantslast 30 patents

Package configuration and manufacturing method enabling the additio...

Semiconductor package having discrete non-active electrical compone...

Package configuration and manufacturing method enabling the additio...

High speed interface design

Ball assignment system

Scaling of functional assignments in packages

Routing structure for transceiver core

Designing a ball assignment for a ball grid array package

Multi-chip package having a contiguous heat spreader assembly

Multi chip module

Integrated circuit packaging that uses guard conductors to isolate...

Dual clock package option

Ball assignment for ball grid array package

Isolated stripline structure

Method for reliability testing leakage characteristics in an electr...

Multi chip module

Integrated circuit test vehicle

High density signal routing

Splitting and assigning power planes

Patents Applicationslast 30 patents

PACKAGE CONFIGURATION AND MANUFACTURING METHOD ENABLING THE ADDITIO...

Scaling of functional assignments in packages

High speed interface design

Ball assignment system

Package configuration and manufacturing method enabling the additio...

Semiconductor package having dicrete non-active electrical componen...

Routing structure for transceiver core

Multi chip module

Ball assignment for ball grid array package