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Leann G. Keim
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Endicott, NY, US
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last 30 patents
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Patent Grant
Gold plating bath additives for copper circuitization on polyimide...
Patent number
5,176,811
Issue date
Jan 5, 1993
International Business Machines Corporation
Leann G. Keim
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
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Patent Grant
Electrolytic method for forming vias and through holes in copper-in...
Patent number
5,108,562
Issue date
Apr 28, 1992
International Business Machines
Peter J. Duke
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR