Leatrice Lea Gallman Adams

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Plano, TX, US

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Patents Grantslast 30 patents

Information Patent Grant
Thermal conduction by encapsulation
- Patent number 7,898,724
- Issue date Mar 1, 2011
- Texas Instruments Incorporated
- Jane Qian Liu
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
THERMAL CONDUCTION BY ENCAPSULATION
- Publication number 20100110527
- Publication date May 6, 2010
- TEXAS INSTRUMENTS INCORPORATED
- Jane Qian Liu
- B81 - MICRO-STRUCTURAL TECHNOLOGY