Lee Alan Stringer

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Frisco, TX, US

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Patents Grantslast 30 patents

Information Patent Grant
Capacitor contact formed concurrently with bond pad metallization
- Patent number 8,431,463
- Issue date Apr 30, 2013
- Texas Instruments Incorporated
- Maxwell Walthour Lippitt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for removing contaminants from aluminum-comprising bond pad...
- Patent number 8,236,703
- Issue date Aug 7, 2012
- Texas Instruments Incorporated
- Alfred J. Griffin, Jr.
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CAPACITOR CONTACT FORMED CONCURRENTLY WITH BOND PAD METALLIZATION
- Publication number 20100032803
- Publication date Feb 11, 2010
- TEXAS INSTRUMENTS INCORPORATED
- Maxwell Walthour Lippitt, III
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR REMOVING CONTAMINANTS FROM ALUMINUM-COMPRISING BOND PAD...
- Publication number 20090068847
- Publication date Mar 12, 2009
- Texas Instruments Inc.
- Alfred J. Griffin, JR.
- H01 - BASIC ELECTRIC ELEMENTS