Lee Brogan

Person

Tualatin, OR, US

People

Patents Grantslast 30 patents

Information Patent Grant
Copper electrofill on non-copper liner layers
- Patent number 12,012,667
- Issue date Jun 18, 2024
- Lam Research Corporation
- Lee J. Brogan
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Monitoring surface oxide on seed layers during electroplating
- Patent number 11,208,732
- Issue date Dec 28, 2021
- Lam Research Corporation
- Ludan Huang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Process for optimizing cobalt electrofill using sacrificial oxidants
- Patent number 11,078,591
- Issue date Aug 3, 2021
- Lam Research Corporation
- Lee J. Brogan
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
TSV bath evaluation using field versus feature contrast
- Patent number 10,508,359
- Issue date Dec 17, 2019
- Lam Research Corporation
- Lee Brogan
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Monitoring surface oxide on seed layers during electroplating
- Patent number 10,443,146
- Issue date Oct 15, 2019
- Lam Research Corporation
- Ludan Huang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Process for optimizing cobalt electrofill using sacrificial oxidants
- Patent number 10,329,683
- Issue date Jun 25, 2019
- Lam Research Corporation
- Lee J. Brogan
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method and apparatus for electroplating semiconductor wafer when co...
- Patent number 9,816,196
- Issue date Nov 14, 2017
- Novellus Systems, Inc.
- Tighe A. Spurlin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
TSV bath evaluation using field versus feature contrast
- Patent number 9,689,083
- Issue date Jun 27, 2017
- Lam Research Corporation
- Lee Brogan
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
METAL OXIDE DIFFUSION BARRIERS
- Publication number 20230260834
- Publication date Aug 17, 2023
- LAM RESEARCH CORPORATION
- Lee J. BROGAN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ELECTROFILL FROM ALKALINE ELECTROPLATING SOLUTIONS
- Publication number 20230227992
- Publication date Jul 20, 2023
- LAM RESEARCH CORPORATION
- Lee J. Brogan
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
WET FUNCTIONALIZATION OF DIELECTRIC SURFACES
- Publication number 20230197509
- Publication date Jun 22, 2023
- LAM RESEARCH CORPORATION
- Lee J. Brogan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PERFORMANCE PREDICTORS FOR SEMICONDUCTOR-MANUFACTURING PROCESSES
- Publication number 20230049157
- Publication date Feb 16, 2023
- LAM RESEARCH CORPORATION
- Kapil Umesh Sawlani
- G05 - CONTROLLING REGULATING
Information Patent Application
COPPER ELECTROFILL ON NON-COPPER LINER LAYERS
- Publication number 20210156045
- Publication date May 27, 2021
- LAM RESEARCH CORPORATION
- Lee J. Brogan
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
MONITORING SURFACE OXIDE ON SEED LAYERS DURING ELECTROPLATING
- Publication number 20190390361
- Publication date Dec 26, 2019
- LAM RESEARCH CORPORATION
- Ludan Huang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PROCESS FOR OPTIMIZING COBALT ELECTROFILL USING SACRIFICIAL OXIDANTS
- Publication number 20190271094
- Publication date Sep 5, 2019
- LAM RESEARCH CORPORATION
- Lee J. Brogan
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
MONITORING SURFACE OXIDE ON SEED LAYERS DURING ELECTROPLATING
- Publication number 20180282894
- Publication date Oct 4, 2018
- LAM RESEARCH CORPORATION
- Ludan Huang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PROCESS FOR OPTIMIZING COBALT ELECTROFILL USING SACRIFICIAL OXIDANTS
- Publication number 20180119305
- Publication date May 3, 2018
- LAM RESEARCH CORPORATION
- Lee J. Brogan
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD AND APPARATUS FOR ELECTROPLATING SEMICONDUCTOR WAFER WHEN CO...
- Publication number 20180030611
- Publication date Feb 1, 2018
- Novellus Systems, Inc.
- Tighe A. Spurlin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
TSV BATH EVALUATION USING FIELD VERSUS FEATURE CONTRAST
- Publication number 20170241041
- Publication date Aug 24, 2017
- LAM RESEARCH CORPORATION
- Lee Brogan
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
TSV BATH EVALUATION USING FIELD VERSUS FEATURE CONTRAST
- Publication number 20140367279
- Publication date Dec 18, 2014
- LAM RESEARCH CORPORATION
- Lee Brogan
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD AND APPARATUS FOR ELECTROPLATING SEMICONDUCTOR WAFER WHEN CO...
- Publication number 20130284604
- Publication date Oct 31, 2013
- Tighe A. Spurlin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Person

Patents Grantslast 30 patents

Copper electrofill on non-copper liner layers

Monitoring surface oxide on seed layers during electroplating

Process for optimizing cobalt electrofill using sacrificial oxidants

TSV bath evaluation using field versus feature contrast

Monitoring surface oxide on seed layers during electroplating

Process for optimizing cobalt electrofill using sacrificial oxidants

Method and apparatus for electroplating semiconductor wafer when co...

TSV bath evaluation using field versus feature contrast

Patents Applicationslast 30 patents

METAL OXIDE DIFFUSION BARRIERS

ELECTROFILL FROM ALKALINE ELECTROPLATING SOLUTIONS

WET FUNCTIONALIZATION OF DIELECTRIC SURFACES

PERFORMANCE PREDICTORS FOR SEMICONDUCTOR-MANUFACTURING PROCESSES

COPPER ELECTROFILL ON NON-COPPER LINER LAYERS

MONITORING SURFACE OXIDE ON SEED LAYERS DURING ELECTROPLATING

PROCESS FOR OPTIMIZING COBALT ELECTROFILL USING SACRIFICIAL OXIDANTS

MONITORING SURFACE OXIDE ON SEED LAYERS DURING ELECTROPLATING

PROCESS FOR OPTIMIZING COBALT ELECTROFILL USING SACRIFICIAL OXIDANTS

METHOD AND APPARATUS FOR ELECTROPLATING SEMICONDUCTOR WAFER WHEN CO...

TSV BATH EVALUATION USING FIELD VERSUS FEATURE CONTRAST

TSV BATH EVALUATION USING FIELD VERSUS FEATURE CONTRAST

METHOD AND APPARATUS FOR ELECTROPLATING SEMICONDUCTOR WAFER WHEN CO...