Lee Choon Kuan

Person

Singapore, SG

People

Patents Grantslast 30 patents

Information Patent Grant
Carrierless chip package for integrated circuit devices, and method...
- Patent number 9,673,121
- Issue date Jun 6, 2017
- Micron Technology, Inc.
- David J. Corisis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Land grid array semiconductor device packages
- Patent number 9,355,992
- Issue date May 31, 2016
- Micron Technology, Inc.
- Lee Choon Kuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assemblies including face-to-face semiconducto...
- Patent number 9,269,695
- Issue date Feb 23, 2016
- Micron Technology, Inc.
- Eric Tan Swee Seng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and methods for forming wire bonds
- Patent number 8,444,044
- Issue date May 21, 2013
- Micron Technology, Inc.
- Low Peng Wang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device assemblies including face-to-face semiconducto...
- Patent number 8,384,200
- Issue date Feb 26, 2013
- Micron Technology, Inc.
- Eric Tan Swee Seng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device packages and assemblies
- Patent number 8,125,092
- Issue date Feb 28, 2012
- Micron Technology, Inc.
- David J. Corisis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic devices including conductive vias having two or more con...
- Patent number 7,767,913
- Issue date Aug 3, 2010
- Micron Technology, Inc.
- David J. Corisis
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Build-up-package for integrated circuit devices, and methods of mak...
- Patent number 7,691,682
- Issue date Apr 6, 2010
- Micron Technology, Inc.
- Ng Hong Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrierless chip package for integrated circuit devices, and method...
- Patent number 7,504,285
- Issue date Mar 17, 2009
- Micron Technology, Inc.
- David J. Corisis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bow control in an electronic package
- Patent number 7,465,488
- Issue date Dec 16, 2008
- Micron Technology, Inc.
- Lee Choon Kuan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip on board leadframe for semiconductor components having area array
- Patent number 7,459,778
- Issue date Dec 2, 2008
- Micron Technology, Inc.
- Dalson Ye Seng Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bow control in an electronic package
- Patent number 7,235,872
- Issue date Jun 26, 2007
- Micron Technology, Inc.
- Lee Choon Kuan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bow control in an electronic package
- Patent number 7,161,236
- Issue date Jan 9, 2007
- Micron Technology, Inc.
- Lee Choon Kuan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for fabricating semiconductor component with chip on board l...
- Patent number 7,049,173
- Issue date May 23, 2006
- Micron Technology, Inc.
- Dalson Ye Seng Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a semiconductor package with multi layered l...
- Patent number 6,972,214
- Issue date Dec 6, 2005
- Micron Technology, Inc.
- Lee Choon Kuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Temporary, conformable contacts for microelectronic components
- Patent number 6,913,476
- Issue date Jul 5, 2005
- Micron Technology, Inc.
- Tay Wuu Yean
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor component having chip on board leadframe
- Patent number 6,903,449
- Issue date Jun 7, 2005
- Micron Technology, Inc.
- Dalson Ye Seng Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor component with multi layered l...
- Patent number 6,835,599
- Issue date Dec 28, 2004
- Micron Technology, Inc.
- Lee Choon Kuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor component having multi layered leadframe
- Patent number 6,784,525
- Issue date Aug 31, 2004
- Micron Technology, Inc.
- Lee Choon Kuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
U-shape tape for BOC FBGA package to improve moldability
- Patent number 6,617,201
- Issue date Sep 9, 2003
- Micron Technology, Inc.
- Lim T. Chye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
BOC semiconductor package including a semiconductor die and a subst...
- Patent number 6,507,114
- Issue date Jan 14, 2003
- Micron Technology, Inc.
- Chong Chin Hui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
U-shape tape for BOC FBGA package to improve moldability
- Patent number 6,486,536
- Issue date Nov 26, 2002
- Micron Technology, Inc.
- Lim T. Chye
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLIES INCLUDING FACE-TO-FACE SEMICONDUCTO...
- Publication number 20150076679
- Publication date Mar 19, 2015
- Micron Technology, Inc.
- Eric Tan Swee Seng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAND GRID ARRAY SEMICONDUCTOR DEVICE PACKAGES
- Publication number 20140342476
- Publication date Nov 20, 2014
- Lee Choon Kuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING SEMICONDUCTOR DEVICE PACKAGES INCLUDING A SEMICO...
- Publication number 20130059419
- Publication date Mar 7, 2013
- Micron Technology, Inc.
- Lee Choon Kuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED MICROELECTRONIC DEVICES AND METHODS FOR MANUFACTURING STACK...
- Publication number 20120108010
- Publication date May 3, 2012
- Micron Technology, Inc.
- Edmund Lua Koon Tian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NOVEL BUILD-UP PACKAGE FOR INTEGRATED CIRCUIT DEVICES, AND METHODS...
- Publication number 20110266701
- Publication date Nov 3, 2011
- Micron Technology, Inc.
- Ng Hong Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE ASSEMBLIES INCLUDING CONDUCTIVE VIAS HAVING TWO O...
- Publication number 20100284140
- Publication date Nov 11, 2010
- Micron Technology, Inc.
- David J. Corisis
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
UPGRADEABLE AND REPAIRABLE SEMICONDUCTOR PACKAGES AND METHODS
- Publication number 20090236735
- Publication date Sep 24, 2009
- Micron Technology, Inc.
- David J. Corisis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHODS FOR FORMING WIRE BONDS
- Publication number 20090223937
- Publication date Sep 10, 2009
- Micron Technology, Inc.
- Low Peng Wang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BOARD-ON-CHIP TYPE SUBSTRATES WITH CONDUCTIVE TRACES IN MULTIPLE PL...
- Publication number 20090218677
- Publication date Sep 3, 2009
- Micron Technology, Inc.
- Lee Choon Kuan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STACKED MICROELECTRONIC DEVICES AND METHODS FOR MANUFACTURING STACK...
- Publication number 20090045496
- Publication date Feb 19, 2009
- Micron Technology, Inc.
- Edmund Lua Tian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED MICROELECTRONIC DEVICES AND METHODS FOR MANUFACTURING MICRO...
- Publication number 20090011541
- Publication date Jan 8, 2009
- Micron Technology, Inc.
- David J. Corisis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NOVEL BUILD-UP-PACKAGE FOR INTEGRATED CIRCUIT DEVICES, AND METHODS...
- Publication number 20090001551
- Publication date Jan 1, 2009
- Ng Hong Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIERLESS CHIP PACKAGE FOR INTEGRATED CIRCUIT DEVICES, AND METHOD...
- Publication number 20080136001
- Publication date Jun 12, 2008
- Micron Technology, Inc.
- David J. Corisis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIERLESS CHIP PACKAGE FOR INTEGRATED CIRCUIT DEVICES, AND METHOD...
- Publication number 20070249100
- Publication date Oct 25, 2007
- Micron Technology, Inc.
- David J. Corisis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Carrierless chip package for integrated circuit devices, and method...
- Publication number 20070216033
- Publication date Sep 20, 2007
- David J. Corisis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device assemblies including face-to-face semiconducto...
- Publication number 20070194415
- Publication date Aug 23, 2007
- Eric Tan Swee Seng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Conductive vias having two or more conductive elements for providin...
- Publication number 20070194431
- Publication date Aug 23, 2007
- David J. Corisis
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Stacked microelectronic devices and methods for manufacturing micro...
- Publication number 20070045862
- Publication date Mar 1, 2007
- Micron Technology, Inc.
- David J. Corisis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Lead frame-based semiconductor device packages incorporating at lea...
- Publication number 20070045784
- Publication date Mar 1, 2007
- David J. Corisis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Land grid array semiconductor device packages, assemblies including...
- Publication number 20070045818
- Publication date Mar 1, 2007
- Lee Choon Kuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOW CONTROL IN AN ELECTRONIC PACKAGE
- Publication number 20060244141
- Publication date Nov 2, 2006
- Micron Technology, Inc.
- Lee Choon Kuan
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Chip on board leadframe for semiconductor components having area array
- Publication number 20060163702
- Publication date Jul 27, 2006
- Dalson Ye Seng Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for fabricating a semiconductor package with multi layered l...
- Publication number 20050087847
- Publication date Apr 28, 2005
- Lee Choon Kuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bow control in an electronic package
- Publication number 20050029552
- Publication date Feb 10, 2005
- Micron Technology, Inc.
- Lee Choon Kuan
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Method for fabricating semiconductor component with chip on board l...
- Publication number 20050023654
- Publication date Feb 3, 2005
- Dalson Ye Seng Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor component having chip on board leadframe and method o...
- Publication number 20050023651
- Publication date Feb 3, 2005
- Dalson Ye Seng Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for fabricating semiconductor component with multi layered l...
- Publication number 20040130010
- Publication date Jul 8, 2004
- Lee Choon Kuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEMPORARY, CONFORMABLE CONTACTS FOR MICROELECTRONIC COMPONENTS
- Publication number 20040029425
- Publication date Feb 12, 2004
- Tay Wuu Yean
- G01 - MEASURING TESTING
Information Patent Application
Bow control in an electronic package
- Publication number 20030047797
- Publication date Mar 13, 2003
- Micron Technology, Inc.
- Lee Choon Kuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
U-shape tape for BOC FBGA package to improve moldability
- Publication number 20030025185
- Publication date Feb 6, 2003
- Lim T. Chye
- H01 - BASIC ELECTRIC ELEMENTS

Lee Choon Kuan

Person

Patents Grantslast 30 patents

Carrierless chip package for integrated circuit devices, and method...

Land grid array semiconductor device packages

Semiconductor device assemblies including face-to-face semiconducto...

Apparatus and methods for forming wire bonds

Semiconductor device assemblies including face-to-face semiconducto...

Semiconductor device packages and assemblies

Electronic devices including conductive vias having two or more con...

Build-up-package for integrated circuit devices, and methods of mak...

Carrierless chip package for integrated circuit devices, and method...

Bow control in an electronic package

Chip on board leadframe for semiconductor components having area array

Bow control in an electronic package

Bow control in an electronic package

Method for fabricating semiconductor component with chip on board l...

Method for fabricating a semiconductor package with multi layered l...

Temporary, conformable contacts for microelectronic components

Semiconductor component having chip on board leadframe

Method for fabricating semiconductor component with multi layered l...

Semiconductor component having multi layered leadframe

U-shape tape for BOC FBGA package to improve moldability

BOC semiconductor package including a semiconductor die and a subst...

U-shape tape for BOC FBGA package to improve moldability

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE ASSEMBLIES INCLUDING FACE-TO-FACE SEMICONDUCTO...

LAND GRID ARRAY SEMICONDUCTOR DEVICE PACKAGES

METHODS OF FORMING SEMICONDUCTOR DEVICE PACKAGES INCLUDING A SEMICO...

STACKED MICROELECTRONIC DEVICES AND METHODS FOR MANUFACTURING STACK...

NOVEL BUILD-UP PACKAGE FOR INTEGRATED CIRCUIT DEVICES, AND METHODS...

ELECTRONIC DEVICE ASSEMBLIES INCLUDING CONDUCTIVE VIAS HAVING TWO O...

UPGRADEABLE AND REPAIRABLE SEMICONDUCTOR PACKAGES AND METHODS

APPARATUS AND METHODS FOR FORMING WIRE BONDS

BOARD-ON-CHIP TYPE SUBSTRATES WITH CONDUCTIVE TRACES IN MULTIPLE PL...

STACKED MICROELECTRONIC DEVICES AND METHODS FOR MANUFACTURING STACK...

STACKED MICROELECTRONIC DEVICES AND METHODS FOR MANUFACTURING MICRO...

NOVEL BUILD-UP-PACKAGE FOR INTEGRATED CIRCUIT DEVICES, AND METHODS...

CARRIERLESS CHIP PACKAGE FOR INTEGRATED CIRCUIT DEVICES, AND METHOD...

CARRIERLESS CHIP PACKAGE FOR INTEGRATED CIRCUIT DEVICES, AND METHOD...

Carrierless chip package for integrated circuit devices, and method...

Semiconductor device assemblies including face-to-face semiconducto...

Conductive vias having two or more conductive elements for providin...

Stacked microelectronic devices and methods for manufacturing micro...

Lead frame-based semiconductor device packages incorporating at lea...

Land grid array semiconductor device packages, assemblies including...

BOW CONTROL IN AN ELECTRONIC PACKAGE

Chip on board leadframe for semiconductor components having area array

Method for fabricating a semiconductor package with multi layered l...

Bow control in an electronic package

Method for fabricating semiconductor component with chip on board l...

Semiconductor component having chip on board leadframe and method o...

Method for fabricating semiconductor component with multi layered l...

TEMPORARY, CONFORMABLE CONTACTS FOR MICROELECTRONIC COMPONENTS

Bow control in an electronic package

U-shape tape for BOC FBGA package to improve moldability