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Lee Fee Ngion
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Melaka, MY
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last 30 patents
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Patent Grant
Shielded semiconductor device and lead frame therefor
Patent number
10,654,709
Issue date
May 19, 2020
NXP USA, INC.
Lee Fee Ngion
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Substrate with electrically isolated bond pads
Patent number
9,209,144
Issue date
Dec 8, 2015
FREESCALE SEMICONDUCTOR, INC.
Lee Fee Ngion
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Method of forming pillar bump
Patent number
9,209,147
Issue date
Dec 8, 2015
FREESCALE SEMICONDUCTOR, INC.
Chee Seng Foong
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
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Patent Application
SHIELDED SEMICONDUCTOR DEVICE AND LEAD FRAME THEREFOR
Publication number
20200131030
Publication date
Apr 30, 2020
NXP USA, Inc.
Lee Fee Ngion
B81 - MICRO-STRUCTURAL TECHNOLOGY