Lee Han Meng@ Eugene Lee

Person

Muar, MY

People

Patents Grantslast 30 patents

Information Patent Grant
Flippable leadframe for packaged electronic system having verticall...
- Patent number 11,742,263
- Issue date Aug 29, 2023
- Texas Instruments Incorporated
- Lee Han Meng@ Eugene Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Locking dual leadframe for flip chip on leadframe packages
- Patent number 11,056,462
- Issue date Jul 6, 2021
- Texas Instruments Incorporated
- Lee Han Meng @ Eugene Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flippable leadframe for packaged electronic system having verticall...
- Patent number 10,879,154
- Issue date Dec 29, 2020
- Texas Instruments Incorporated
- Lee Han Meng@ Eugene Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for making a multilevel leadframe by etching a conductive s...
- Patent number 10,804,114
- Issue date Oct 13, 2020
- Texas Instruments Incorporated
- Lee Han Meng@ Eugene Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor system having interposer of half-etched and m...
- Patent number 10,720,406
- Issue date Jul 21, 2020
- Texas Instruments Incorporated
- Lee Han Meng@ Eugene Lee
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Methods of assembling a flip chip on a locking dual leadframe
- Patent number 10,541,225
- Issue date Jan 21, 2020
- Texas Instruments Incorporated
- Lee Han Meng @ Eugene Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor system having interposer of half-etched and m...
- Patent number 10,515,928
- Issue date Dec 24, 2019
- Texas Instruments Incorporated
- Lee Han Meng@ Eugene Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor device having leadframe features preventing...
- Patent number 9,892,936
- Issue date Feb 13, 2018
- Texas Instruments Incorporated
- Wei Fen Sueann Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package fabrication
- Patent number 9,859,197
- Issue date Jan 2, 2018
- Texas Instruments Incorporated
- Lee Han Meng@ Eugene Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit assembly
- Patent number 9,842,807
- Issue date Dec 12, 2017
- Texas Instruments Incorporated
- Lee Han Meng@ Eugene Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming a panel of triple stack semiconductor packages
- Patent number 9,691,748
- Issue date Jun 27, 2017
- Texas Instruments Incorporated
- Lee Han Meng @ Eugene Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor device having leadframe features preventing...
- Patent number 9,515,009
- Issue date Dec 6, 2016
- Texas Instruments Incorporated
- Sueann Lim Wei Fen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flippable leadframe for packaged electronic system having verticall...
- Patent number 9,496,206
- Issue date Nov 15, 2016
- Texas Instruments Incorporated
- Lee Han Meng @ Eugene Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Triple stack semiconductor package
- Patent number 9,324,640
- Issue date Apr 26, 2016
- Texas Instruments Incorporated
- Lee Han Meng @ Eugene Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package
- Patent number 9,275,983
- Issue date Mar 1, 2016
- Texas Instruments Incorporated
- Lee Han Meng@ Eugene Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame with abutment surface
- Patent number 9,184,119
- Issue date Nov 10, 2015
- Texas Instruments Incorporated
- Lee Han Meng@ Eugene Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Flippable Leadframe for Packaged Electronic System Having Verticall...
- Publication number 20210074613
- Publication date Mar 11, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Lee Han Meng@ Eugene Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR SYSTEM HAVING INTERPOSER OF HALF-ETCHED AND M...
- Publication number 20200091111
- Publication date Mar 19, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Lee Han Meng@ Eugene Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOCKING DUAL LEADFRAME FOR FLIP CHIP ON LEADFRAME PACKAGES
- Publication number 20170345790
- Publication date Nov 30, 2017
- TEXAS INSTRUMENTS INCORPORATED
- Lee Han Meng @ Eugene Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOCKING DUAL LEADFRAME FOR FLIP CHIP ON LEADFRAME PACKAGES
- Publication number 20170309595
- Publication date Oct 26, 2017
- TEXAS INSTRUMENTS INCORPORATED
- Lee Han Meng @ Eugene Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT ASSEMBLY
- Publication number 20170110408
- Publication date Apr 20, 2017
- TEXAS INSTRUMENTS INCORPORATED
- Lee Han Meng@ Eugene Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaged Semiconductor Device Having Leadframe Features Preventing...
- Publication number 20170053814
- Publication date Feb 23, 2017
- TEXAS INSTRUMENTS INCORPORATED
- SUEANN LIM WEI FEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flippable Leadframe for Packaged Electronic System Having Verticall...
- Publication number 20170025332
- Publication date Jan 26, 2017
- TEXAS INSTRUMENTS INCORPORATED
- Lee Han Meng@ Eugene Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIPPABLE LEADFRAME FOR PACKAGED ELECTRONIC SYSTEM HAVING VERTICALL...
- Publication number 20160300784
- Publication date Oct 13, 2016
- TEXAS INSTRUMENTS INCORPORATED
- Lee Han Meng@ Eugene Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multilevel Leadframe
- Publication number 20160240390
- Publication date Aug 18, 2016
- TEXAS INSTRUMENTS INCORPORATED
- Lee Han Meng@ Eugene Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED SEMICONDUCTOR DEVICE HAVING LEADFRAME FEATURES PREVENTING...
- Publication number 20160204052
- Publication date Jul 14, 2016
- TEXAS INSTRUMENTS INCORPORATED
- SUEANN LIM WEI FEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAKING A FLAT NO-LEAD PACKAGE WITH EXPOSED ELECTROPLATED SIDE LEAD...
- Publication number 20160181122
- Publication date Jun 23, 2016
- TEXAS INSTRUMENTS INCORPORATED
- Lee Han Meng@ Eugene Lee
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
FORMING A PANEL OF TRIPLE STACK SEMICONDUCTOR PACKAGES
- Publication number 20160133617
- Publication date May 12, 2016
- TEXAS INSTRUMENTS INCORPORATED
- LEE HAN MENG @ EUGENE LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRIPLE STACK SEMICONDUCTOR PACKAGE
- Publication number 20160126230
- Publication date May 5, 2016
- TEXAS INSTRUMENTS INCORPORATED
- LEE HAN MENG @ EUGENE LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE
- Publication number 20150243641
- Publication date Aug 27, 2015
- TEXAS INSTRUMENTS INCORPORATED
- Lee Han Meng@ Eugene Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME WITH ABUTMENT SURFACE
- Publication number 20150228563
- Publication date Aug 13, 2015
- TEXAS INSTRUMENTS INCORPORATED
- Lee Han Meng@ Eugene Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE FABRICATION
- Publication number 20150228581
- Publication date Aug 13, 2015
- TEXAS INSTRUMENTS INCORPORATED
- Lee Han Meng@ Eugene Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multilevel Leadframe
- Publication number 20150108626
- Publication date Apr 23, 2015
- TEXAS INSTRUMENTS INCORPORATED
- Lee Han Meng@ Eugene Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOCKING DUAL LEADFRAME FOR FLIP CHIP ON LEADFRAME PACKAGES
- Publication number 20150060123
- Publication date Mar 5, 2015
- TEXAS INSTRUMENTS INCORPORATED
- LEE HAN MENG @ EUGENE LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multilevel Leadframe
- Publication number 20140346656
- Publication date Nov 27, 2014
- Lee Han Meng@ Eugene Lee
- H01 - BASIC ELECTRIC ELEMENTS

Lee Han Meng@ Eugene Lee

Person

Patents Grantslast 30 patents

Flippable leadframe for packaged electronic system having verticall...

Locking dual leadframe for flip chip on leadframe packages

Flippable leadframe for packaged electronic system having verticall...

Methods for making a multilevel leadframe by etching a conductive s...

Stacked semiconductor system having interposer of half-etched and m...

Methods of assembling a flip chip on a locking dual leadframe

Stacked semiconductor system having interposer of half-etched and m...

Packaged semiconductor device having leadframe features preventing...

Integrated circuit package fabrication

Integrated circuit assembly

Forming a panel of triple stack semiconductor packages

Packaged semiconductor device having leadframe features preventing...

Flippable leadframe for packaged electronic system having verticall...

Triple stack semiconductor package

Integrated circuit package

Lead frame with abutment surface

Patents Applicationslast 30 patents

Flippable Leadframe for Packaged Electronic System Having Verticall...

STACKED SEMICONDUCTOR SYSTEM HAVING INTERPOSER OF HALF-ETCHED AND M...

LOCKING DUAL LEADFRAME FOR FLIP CHIP ON LEADFRAME PACKAGES

LOCKING DUAL LEADFRAME FOR FLIP CHIP ON LEADFRAME PACKAGES

INTEGRATED CIRCUIT ASSEMBLY

Packaged Semiconductor Device Having Leadframe Features Preventing...

Flippable Leadframe for Packaged Electronic System Having Verticall...

FLIPPABLE LEADFRAME FOR PACKAGED ELECTRONIC SYSTEM HAVING VERTICALL...

Multilevel Leadframe

PACKAGED SEMICONDUCTOR DEVICE HAVING LEADFRAME FEATURES PREVENTING...

MAKING A FLAT NO-LEAD PACKAGE WITH EXPOSED ELECTROPLATED SIDE LEAD...

FORMING A PANEL OF TRIPLE STACK SEMICONDUCTOR PACKAGES

TRIPLE STACK SEMICONDUCTOR PACKAGE

INTEGRATED CIRCUIT PACKAGE

LEAD FRAME WITH ABUTMENT SURFACE

INTEGRATED CIRCUIT PACKAGE FABRICATION

Multilevel Leadframe

LOCKING DUAL LEADFRAME FOR FLIP CHIP ON LEADFRAME PACKAGES

Multilevel Leadframe