Lee Han Meng Eugene LEE

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Patents Grantslast 30 patents

Information Patent Grant
Module package with embedded substrate and leadframe
- Patent number 8,304,887
- Issue date Nov 6, 2012
- Texas Instruments Incorporated
- Lee Han Meng @ Eugene Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tie bar and mold cavity bar arrangements for multiple leadframe sta...
- Patent number 8,203,199
- Issue date Jun 19, 2012
- National Semiconductor Corporation
- Lee Han Meng Eugene Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three piece mold cavity design for packaging integrated circuits
- Patent number 8,105,063
- Issue date Jan 31, 2012
- National Semiconductor Corporation
- Lee Han Meng @Eugene Lee
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Delamination resistant device package having low moisture sensitivity
- Patent number 8,097,934
- Issue date Jan 17, 2012
- National Semiconductor Corporation
- Felix C. Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe packages having enhanced ground-bond reliability
- Patent number 8,093,707
- Issue date Jan 10, 2012
- National Semiconductor Corporation
- Shaw Wei Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
TO263 device package having low moisture sensitivity
- Patent number 7,838,980
- Issue date Nov 23, 2010
- National Semiconductor Corporation
- Yee Kim Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DELAMINATION RESISTANT DEVICE PACKAGE HAVING RAISED BOND SURFACE AN...
- Publication number 20120080781
- Publication date Apr 5, 2012
- National Semiconductor Corporation
- Felix C. LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TIE BAR AND MOLD CAVITY BAR ARRANGEMENTS FOR MULTIPLE LEADFRAME STA...
- Publication number 20110140249
- Publication date Jun 16, 2011
- National Semiconductor Corporation
- Lee Han Meng Eugene LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DAP GROUND BOND ENHANCEMENT
- Publication number 20110140253
- Publication date Jun 16, 2011
- National Semiconductor Corporation
- Shaw Wei LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULE PACKAGE WITH EMBEDDED SUBSTRATE AND LEADFRAME
- Publication number 20110140262
- Publication date Jun 16, 2011
- National Semiconductor Corporation
- Lee Han Meng Eugene LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAME PACKAGES HAVING ENHANCED GROUND-BOND RELIABILITY
- Publication number 20110089556
- Publication date Apr 21, 2011
- National Semiconductor Corporation
- Shaw Wei LEE
- H01 - BASIC ELECTRIC ELEMENTS