Lee Kian Chai

Person

Singapore, SG

People

Patents Grantslast 30 patents

Information Patent Grant
Method for fabricating semiconductor package with multi-layer die c...
- Patent number 7,550,315
- Issue date Jun 23, 2009
- Micron Technology, Inc.
- Victor Tan Cher 'Khng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bow control in an electronic package
- Patent number 7,465,488
- Issue date Dec 16, 2008
- Micron Technology, Inc.
- Lee Choon Kuan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for fabricating semiconductor package with multi-layer metal...
- Patent number 7,253,022
- Issue date Aug 7, 2007
- Micron Technology, Inc.
- Victor Tan Cher 'Khng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bow control in an electronic package
- Patent number 7,235,872
- Issue date Jun 26, 2007
- Micron Technology, Inc.
- Lee Choon Kuan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package with wire bonded stacked dice and multi-layer...
- Patent number 7,208,828
- Issue date Apr 24, 2007
- Micron Technology, Inc.
- Victor Tan Cher 'Khng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having substrate with multi-layer metal bumps
- Patent number 7,202,556
- Issue date Apr 10, 2007
- Micron Technology, Inc.
- Victor Tan Cher 'Khng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bow control in an electronic package
- Patent number 7,161,236
- Issue date Jan 9, 2007
- Micron Technology, Inc.
- Lee Choon Kuan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for encapsulating intermediate conductive elements connectin...
- Patent number 6,781,248
- Issue date Aug 24, 2004
- Micron Technology, Inc.
- Chong Chin Hui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating BOC semiconductor package
- Patent number 6,638,792
- Issue date Oct 28, 2003
- Micron Technology, Inc.
- Chong Chin Hui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
BOC semiconductor package including a semiconductor die and a subst...
- Patent number 6,507,114
- Issue date Jan 14, 2003
- Micron Technology, Inc.
- Chong Chin Hui
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR FABRICATING SEMICONDUCTOR PACKAGE WITH MULTI-LAYER DIE C...
- Publication number 20070262469
- Publication date Nov 15, 2007
- VICTOR TAN CHER 'KHNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOW CONTROL IN AN ELECTRONIC PACKAGE
- Publication number 20060244141
- Publication date Nov 2, 2006
- Micron Technology, Inc.
- Lee Choon Kuan
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Semiconductor package having wire bonded die and multi layer metal...
- Publication number 20050173788
- Publication date Aug 11, 2005
- Victor Tan Cher 'Khng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bow control in an electronic package
- Publication number 20050029552
- Publication date Feb 10, 2005
- Micron Technology, Inc.
- Lee Choon Kuan
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Method for fabricating semiconductor package with multi-layer metal...
- Publication number 20040232564
- Publication date Nov 25, 2004
- Victor Tan Cher 'Khng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package having substrate with multi-layer metal bumps
- Publication number 20030116866
- Publication date Jun 26, 2003
- Victor Tan Cher 'Khng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bow control in an electronic package
- Publication number 20030047797
- Publication date Mar 13, 2003
- Micron Technology, Inc.
- Lee Choon Kuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for encapsulating intermediate conductive elements connectin...
- Publication number 20020172024
- Publication date Nov 21, 2002
- Chong Chin Hui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOC semiconductor package including a semiconductor die and a subst...
- Publication number 20020100976
- Publication date Aug 1, 2002
- Chong Chin Hui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for fabricating BOC semiconductor package
- Publication number 20020102831
- Publication date Aug 1, 2002
- Chong Chin Hui
- H01 - BASIC ELECTRIC ELEMENTS

Lee Kian Chai

Person

Patents Grantslast 30 patents

Method for fabricating semiconductor package with multi-layer die c...

Bow control in an electronic package

Method for fabricating semiconductor package with multi-layer metal...

Bow control in an electronic package

Semiconductor package with wire bonded stacked dice and multi-layer...

Semiconductor package having substrate with multi-layer metal bumps

Bow control in an electronic package

Method for encapsulating intermediate conductive elements connectin...

Method for fabricating BOC semiconductor package

BOC semiconductor package including a semiconductor die and a subst...

Patents Applicationslast 30 patents

METHOD FOR FABRICATING SEMICONDUCTOR PACKAGE WITH MULTI-LAYER DIE C...

BOW CONTROL IN AN ELECTRONIC PACKAGE

Semiconductor package having wire bonded die and multi layer metal...

Bow control in an electronic package

Method for fabricating semiconductor package with multi-layer metal...

Semiconductor package having substrate with multi-layer metal bumps

Bow control in an electronic package

Method for encapsulating intermediate conductive elements connectin...

BOC semiconductor package including a semiconductor die and a subst...

Method for fabricating BOC semiconductor package