Lee Shuang Wang

Person

Melaka, MY

People

Patents Grantslast 30 patents

Information Patent Grant
Package with electrically insulated carrier and at least one step o...
- Patent number 12,094,793
- Issue date Sep 17, 2024
- Infineon Technologies AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with electrically insulated carrier and at least one step o...
- Patent number 11,876,028
- Issue date Jan 16, 2024
- Infineon Technologies AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a semiconductor device by using different co...
- Patent number 11,804,424
- Issue date Oct 31, 2023
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package, semiconductor assembly and method for fabric...
- Patent number 11,676,881
- Issue date Jun 13, 2023
- Infineon Technologies AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package lead design with grooves for improved dambar separation
- Patent number 11,362,023
- Issue date Jun 14, 2022
- Infineon Technologies AG
- Jayaganasan Narayanasamy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package
- Patent number 11,355,424
- Issue date Jun 7, 2022
- Infineon Technologies AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package and lead frame design for enhanced creepage and clearance
- Patent number 11,348,866
- Issue date May 31, 2022
- Infineon Technologies Austria AG
- Thai Kee Gan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frames including lead posts in different planes
- Patent number 11,011,456
- Issue date May 18, 2021
- Infineon Technologies AG
- Thai Kee Gan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonded package with single piece exposed heat slug and leads
- Patent number 10,840,164
- Issue date Nov 17, 2020
- Infineon Technologies AG
- Chii Shang Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip package having a repeating footprint pattern
- Patent number 10,204,845
- Issue date Feb 12, 2019
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package for multiphase circuitry device
- Patent number 10,147,703
- Issue date Dec 4, 2018
- Infineon Technologies AG
- Stefan Macheiner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Functionalized interface structure
- Patent number 9,922,910
- Issue date Mar 20, 2018
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE WITH ELECTRICALLY INSULATED CARRIER AND AT LEAST ONE STEP O...
- Publication number 20240395646
- Publication date Nov 28, 2024
- INFINEON TECHNOLOGIES AG
- Edward FUERGUT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR PACKAGE INCLUDING A PASSIVE ELECTRONIC COMPONEN...
- Publication number 20240312936
- Publication date Sep 19, 2024
- Infineon Technologies Austria AG
- Joon Shyan Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH LOW-WARPAGE CARRIER
- Publication number 20240222234
- Publication date Jul 4, 2024
- INFINEON TECHNOLOGIES AG
- Abdul Rahman MOHAMED
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH ELECTRICALLY INSULATED CARRIER AND AT LEAST ONE STEP O...
- Publication number 20240038612
- Publication date Feb 1, 2024
- INFINEON TECHNOLOGIES AG
- Edward FUERGUT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING AN EMBEDDED ELECTRICAL CONDUCTOR CONNE...
- Publication number 20230361009
- Publication date Nov 9, 2023
- INFINEON TECHNOLOGIES AG
- Lee Shuang WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES INCLUDING A PACKAGE BODY WITH GROOVES FORMED...
- Publication number 20230298956
- Publication date Sep 21, 2023
- INFINEON TECHNOLOGIES AG
- Chii Shang HONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH ELECTRICALLY INSULATED CARRIER AND AT LEAST ONE STEP O...
- Publication number 20220157682
- Publication date May 19, 2022
- INFINEON TECHNOLOGIES AG
- Edward FUERGUT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES INCLUDING A U-SHAPED RAIL
- Publication number 20220108949
- Publication date Apr 7, 2022
- INFINEON TECHNOLOGIES AG
- Lee Shuang WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package and Lead Frame Design for Enhanced Creepage and Clearance
- Publication number 20210391246
- Publication date Dec 16, 2021
- Infineon Technologies Austria AG
- Thai Kee Gan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Fabricating a Semiconductor Device by Using Different Co...
- Publication number 20210175157
- Publication date Jun 10, 2021
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Chip Package
- Publication number 20210074614
- Publication date Mar 11, 2021
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE, SEMICONDUCTOR ASSEMBLY AND METHOD FOR FABRIC...
- Publication number 20210020539
- Publication date Jan 21, 2021
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package Lead Design with Grooves for Improved Dambar Separation
- Publication number 20210013135
- Publication date Jan 14, 2021
- Jayaganasan Narayanasamy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAMES INCLUDING LEAD POSTS IN DIFFERENT PLANES
- Publication number 20210005541
- Publication date Jan 7, 2021
- INFINEON TECHNOLOGIES AG
- Thai Kee Gan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wire Bonded Package with Single Piece Exposed Heat Slug and Leads
- Publication number 20190355643
- Publication date Nov 21, 2019
- INFINEON TECHNOLOGIES AG
- Chii Shang Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE FOR MULTIPHASE CIRCUITRY DEVICE
- Publication number 20180277513
- Publication date Sep 27, 2018
- INFINEON TECHNOLOGIES AG
- Stefan Macheiner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Chip Package Having a Repeating Footprint Pattern
- Publication number 20180061745
- Publication date Mar 1, 2018
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Functionalized interface structure
- Publication number 20170098598
- Publication date Apr 6, 2017
- Infineon Technologies Austria AG
- Ralf OTREMBA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Devices with Increased Creepage Distances
- Publication number 20160365296
- Publication date Dec 15, 2016
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS

Lee Shuang Wang

Person

Patents Grantslast 30 patents

Package with electrically insulated carrier and at least one step o...

Package with electrically insulated carrier and at least one step o...

Method for fabricating a semiconductor device by using different co...

Semiconductor package, semiconductor assembly and method for fabric...

Package lead design with grooves for improved dambar separation

Multi-chip package

Package and lead frame design for enhanced creepage and clearance

Lead frames including lead posts in different planes

Wire bonded package with single piece exposed heat slug and leads

Semiconductor chip package having a repeating footprint pattern

Semiconductor package for multiphase circuitry device

Functionalized interface structure

Patents Applicationslast 30 patents

PACKAGE WITH ELECTRICALLY INSULATED CARRIER AND AT LEAST ONE STEP O...

POWER SEMICONDUCTOR PACKAGE INCLUDING A PASSIVE ELECTRONIC COMPONEN...

PACKAGE WITH LOW-WARPAGE CARRIER

PACKAGE WITH ELECTRICALLY INSULATED CARRIER AND AT LEAST ONE STEP O...

SEMICONDUCTOR PACKAGE HAVING AN EMBEDDED ELECTRICAL CONDUCTOR CONNE...

SEMICONDUCTOR PACKAGES INCLUDING A PACKAGE BODY WITH GROOVES FORMED...

PACKAGE WITH ELECTRICALLY INSULATED CARRIER AND AT LEAST ONE STEP O...

SEMICONDUCTOR PACKAGES INCLUDING A U-SHAPED RAIL

Package and Lead Frame Design for Enhanced Creepage and Clearance

Method for Fabricating a Semiconductor Device by Using Different Co...

Multi-Chip Package

SEMICONDUCTOR PACKAGE, SEMICONDUCTOR ASSEMBLY AND METHOD FOR FABRIC...

Package Lead Design with Grooves for Improved Dambar Separation

LEAD FRAMES INCLUDING LEAD POSTS IN DIFFERENT PLANES

Wire Bonded Package with Single Piece Exposed Heat Slug and Leads

SEMICONDUCTOR PACKAGE FOR MULTIPHASE CIRCUITRY DEVICE

Semiconductor Chip Package Having a Repeating Footprint Pattern

Functionalized interface structure

Electronic Devices with Increased Creepage Distances