Lee Teck Kheng

Person

Singapore, SG

People

Patents Grantslast 30 patents

Information Patent Grant
System and apparatus for guiding an instrument
- Patent number 11,633,236
- Issue date Apr 25, 2023
- INVIVO MEDICAL PTE LTD
- Foo Soo Leong
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
System and apparatus for guiding an instrument
- Patent number 10,835,323
- Issue date Nov 17, 2020
- Institute of Technical Education
- Foo Soo Leong
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Methods of forming semiconductor packages
- Patent number 7,572,670
- Issue date Aug 11, 2009
- Micron Technology, Inc.
- Lee Teck Kheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 7,262,499
- Issue date Aug 28, 2007
- Micron Technology, Inc.
- Lee Teck Kheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming circuit traces and contact pads for interposers...
- Patent number 6,913,952
- Issue date Jul 5, 2005
- Micron Technology, Inc.
- Stephen F. Moxham
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SYSTEM AND APPARATUS FOR GUIDING AN INSTRUMENT
- Publication number 20210059768
- Publication date Mar 4, 2021
- Institute of Technical Education
- Foo Soo Leong
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
SYSTEM AND APPARATUS FOR GUIDING AN INSTRUMENT
- Publication number 20160206383
- Publication date Jul 21, 2016
- Institute of Technical Education
- Foo Soo Leong
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
PARTITIONED THROUGH-LAYER VIA AND ASSOCIATED SYSTEMS AND METHODS
- Publication number 20090057912
- Publication date Mar 5, 2009
- Micron Technology, Inc.
- Lee Teck Kheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Methods of forming semiconductor packages
- Publication number 20060134826
- Publication date Jun 22, 2006
- Lee Teck Kheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor packages
- Publication number 20060055010
- Publication date Mar 16, 2006
- Lee Teck Kheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor packages
- Publication number 20060055052
- Publication date Mar 16, 2006
- Lee Teck Kheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of forming semiconductor packages
- Publication number 20060055033
- Publication date Mar 16, 2006
- Lee Teck Kheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor packages, and methods of forming semiconductor packages
- Publication number 20050230821
- Publication date Oct 20, 2005
- Lee Teck Kheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of forming circuit traces and contact pads for interposers...
- Publication number 20050003607
- Publication date Jan 6, 2005
- Stephen F. Moxham
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Lee Teck Kheng

Person

Patents Grantslast 30 patents

System and apparatus for guiding an instrument

System and apparatus for guiding an instrument

Methods of forming semiconductor packages

Semiconductor packages

Methods of forming circuit traces and contact pads for interposers...

Patents Applicationslast 30 patents

SYSTEM AND APPARATUS FOR GUIDING AN INSTRUMENT

SYSTEM AND APPARATUS FOR GUIDING AN INSTRUMENT

PARTITIONED THROUGH-LAYER VIA AND ASSOCIATED SYSTEMS AND METHODS

Methods of forming semiconductor packages

Semiconductor packages

Semiconductor packages

Methods of forming semiconductor packages

Semiconductor packages, and methods of forming semiconductor packages

Methods of forming circuit traces and contact pads for interposers...