Lee Wang Lai

Person

Singapore, SG

People

Patents Grantslast 30 patents

Information Patent Grant
Stacked die package for peripheral and center device pad layout device
- Patent number 8,269,328
- Issue date Sep 18, 2012
- Micron Technology, Inc.
- Dalson Ye Seng Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked die package for peripheral and center device pad layout device
- Patent number 7,846,768
- Issue date Dec 7, 2010
- Micron Technology, Inc.
- Dalson Ye Seng Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked die package for peripheral and center device pad layout device
- Patent number 7,425,463
- Issue date Sep 16, 2008
- Micron Technology, Inc.
- Dalson Ye Seng Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked device package for peripheral and center device pad layout...
- Patent number 7,205,656
- Issue date Apr 17, 2007
- Micron Technology, Inc.
- Dalson Ye Seng Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a semiconductor package with multi layered l...
- Patent number 6,972,214
- Issue date Dec 6, 2005
- Micron Technology, Inc.
- Lee Choon Kuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor component with multi layered l...
- Patent number 6,835,599
- Issue date Dec 28, 2004
- Micron Technology, Inc.
- Lee Choon Kuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor component having multi layered leadframe
- Patent number 6,784,525
- Issue date Aug 31, 2004
- Micron Technology, Inc.
- Lee Choon Kuan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
STACKED DIE PACKAGE FOR PERIPHERAL AND CENTER DEVICE PAD LAYOUT DEVICE
- Publication number 20110062583
- Publication date Mar 17, 2011
- Micron Technology, Inc.
- Dalson Ye Seng Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED DIE PACKAGE FOR PERIPHERAL AND CENTER DEVICE PAD LAYOUT DEVICE
- Publication number 20080280396
- Publication date Nov 13, 2008
- Micron Technology, Inc.
- Dalson Ye Seng Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked die package for peripheral and center device pad layout device
- Publication number 20060246622
- Publication date Nov 2, 2006
- Dalson Ye Seng Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked device package for peripheral and center device pad layout...
- Publication number 20060197206
- Publication date Sep 7, 2006
- Dalson Ye Seng Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for fabricating a semiconductor package with multi layered l...
- Publication number 20050087847
- Publication date Apr 28, 2005
- Lee Choon Kuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for fabricating semiconductor component with multi layered l...
- Publication number 20040130010
- Publication date Jul 8, 2004
- Lee Choon Kuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package having multi-layer leadframe and method of fa...
- Publication number 20040080046
- Publication date Apr 29, 2004
- Lee Choon Kuan
- H01 - BASIC ELECTRIC ELEMENTS

Lee Wang Lai

Person

Patents Grantslast 30 patents

Stacked die package for peripheral and center device pad layout device

Stacked die package for peripheral and center device pad layout device

Stacked die package for peripheral and center device pad layout device

Stacked device package for peripheral and center device pad layout...

Method for fabricating a semiconductor package with multi layered l...

Method for fabricating semiconductor component with multi layered l...

Semiconductor component having multi layered leadframe

Patents Applicationslast 30 patents

STACKED DIE PACKAGE FOR PERIPHERAL AND CENTER DEVICE PAD LAYOUT DEVICE

STACKED DIE PACKAGE FOR PERIPHERAL AND CENTER DEVICE PAD LAYOUT DEVICE

Stacked die package for peripheral and center device pad layout device

Stacked device package for peripheral and center device pad layout...

Method for fabricating a semiconductor package with multi layered l...

Method for fabricating semiconductor component with multi layered l...

Semiconductor package having multi-layer leadframe and method of fa...