Leena P. Buchwalter

Person

Hopewell Junction, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Interconnections for flip-chip using lead-free solders and having i...
- Patent number 8,314,500
- Issue date Nov 20, 2012
- Ultratech, Inc.
- Luc Belanger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low temperature Bi-CMOS compatible process for MEMS RF resonators a...
- Patent number 8,269,291
- Issue date Sep 18, 2012
- International Business Machines Corporation
- Leena Paivikki Buchwalter
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Laser release process for very thin Si-carrier build
- Patent number 8,187,923
- Issue date May 29, 2012
- International Business Machines Corporation
- Paul Stephen Andry
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Low temperature Bi-CMOS compatible process for MEMS RF resonators a...
- Patent number 7,943,412
- Issue date May 17, 2011
- International Business Machines Corporation
- Leena Paivikki Buchwalter
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Interconnection for flip-chip using lead-free solders and having im...
- Patent number 7,932,169
- Issue date Apr 26, 2011
- International Business Machines Corporation
- Luc Belanger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Centrifugal method for filing high aspect ratio blind mirco vias po...
- Patent number 7,815,968
- Issue date Oct 19, 2010
- International Business Machines Corporation
- Gareth Hougham
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Method for precision assembly of integrated circuit chip packages
- Patent number 7,615,405
- Issue date Nov 10, 2009
- International Business Machines Corporation
- Paul Stephen Andry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to create flexible connections for integrated circuits
- Patent number 7,456,046
- Issue date Nov 25, 2008
- International Business Machines Corporation
- Leena Paivikki Buchwalter
- G01 - MEASURING TESTING
Information Patent Grant
Centrifugal method for filing high aspect ratio blind micro vias wi...
- Patent number 7,452,568
- Issue date Nov 18, 2008
- International Business Machines Corporation
- Gareth Hougham
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Method for precision assembly of integrated circuit chip packages
- Patent number 7,282,391
- Issue date Oct 16, 2007
- International Business Machines Corporation
- Paul Stephen Andry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon chip carrier with conductive through-vias and method for fa...
- Patent number 7,276,787
- Issue date Oct 2, 2007
- International Business Machines Corporation
- Daniel Charles Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Materials and method to seal vias in silicon substrates
- Patent number 7,199,450
- Issue date Apr 3, 2007
- International Business Machines Corporation
- Jon A. Casey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon chip carrier with through-vias using laser assisted chemica...
- Patent number 7,019,402
- Issue date Mar 28, 2006
- International Business Machines Corporation
- Paul Stephen Andry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microswitch with a micro-electromechanical system
- Patent number 6,818,843
- Issue date Nov 16, 2004
- Telefonaktiebolaget LM Ericsson
- Michael Meixner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma treatment to enhance inorganic dielectric adhesion to copper
- Patent number 6,593,660
- Issue date Jul 15, 2003
- International Business Machines Corporation
- Leena P. Buchwalter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip interconnect wiring structure with low dielectric constant ins...
- Patent number 6,577,011
- Issue date Jun 10, 2003
- International Business Machines Corporation
- Leena P. Buchwalter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma treatment to enhance inorganic dielectric adhesion to copper
- Patent number 6,261,951
- Issue date Jul 17, 2001
- International Business Machines Corporation
- Leena P. Buchwalter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma treatment to enhance inorganic dielectric adhesion to copper
- Patent number 6,255,217
- Issue date Jul 3, 2001
- International Business Machines Corporation
- Paul D. Agnello
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip interconnect wiring structure with low dielectric constant ins...
- Patent number 6,184,121
- Issue date Feb 6, 2001
- International Business Machines Corporation
- Leena P. Buchwalter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for producing a metal organic polymer combination
- Patent number 5,340,451
- Issue date Aug 23, 1994
- International Business Machines Corporation
- Leena P. Buchwalter
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Surface midification of a polyimide
- Patent number 5,133,840
- Issue date Jul 28, 1992
- International Business Machines Corporation
- Leena P. Buchwalter
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
LOW TEMPERATURE BI-CMOS COMPATIBLE PROCESS FOR MEMS RF RESONATORS A...
- Publication number 20120270351
- Publication date Oct 25, 2012
- International Business Machines Corporation
- Leena Paivikki Buchwalter
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
LASER RELEASE PROCESS FOR VERY THIN SI-CARRIER BUILD
- Publication number 20120091585
- Publication date Apr 19, 2012
- International Business Machines Corporation
- Leena P. Buchwalter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Low Temperature BI-CMOS Compatible Process For MEMS RF Resonators a...
- Publication number 20110109405
- Publication date May 12, 2011
- International Business Machines Corporation
- Leena Paivikki Buchwalter
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Interconnection for flip-chip using lead-free solders and having im...
- Publication number 20100062597
- Publication date Mar 11, 2010
- Luc Belanger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Low temperature bi-CMOS compatible process for MEMS RF resonators a...
- Publication number 20090108381
- Publication date Apr 30, 2009
- International Business Machines Corporation
- Leena Paivikki Buchwalter
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CENTRIFUGAL METHOD FOR FILING HIGH ASPECT RATIO BLIND MICRO VIAS WI...
- Publication number 20090032962
- Publication date Feb 5, 2009
- International Business Machines Corporation (Yorktown)
- Gareth Hougham
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LASER RELEASE PROCESS FOR VERY THIN SI-CARRIER BUILD
- Publication number 20090032920
- Publication date Feb 5, 2009
- International Business Machines Corporation
- Leena P. Buchwalter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD TO CREATE FLEXIBLE CONNECTIONS FOR INTEGRATED CIRCUITS
- Publication number 20080217778
- Publication date Sep 11, 2008
- International Business Machines Corporation
- Leena Paivikki Buchwalter
- G01 - MEASURING TESTING
Information Patent Application
METHOD FOR PRECISION ASSEMBLY OF INTEGRATED CIRCUIT CHIP PACKAGES
- Publication number 20080182362
- Publication date Jul 31, 2008
- Paul Stephen Andry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTIONS FOR FLIP-CHIP USING LEAD-FREE SOLDERS AND HAVING I...
- Publication number 20080157395
- Publication date Jul 3, 2008
- Luc Belanger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Laser release process for very thin Si-carrier build
- Publication number 20080036084
- Publication date Feb 14, 2008
- International Business Machines Corporation
- Leena P. Buchwalter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD TO CREATE FLEXIBLE CONNECTIONS FOR INTEGRATED CIRCUITS
- Publication number 20080029889
- Publication date Feb 7, 2008
- International Business Machines Corporation
- Leena Paivikki Buchwalter
- G01 - MEASURING TESTING
Information Patent Application
METHOD FOR PRECISION ASSEMBLY OF INTEGRATED CIRCUIT CHIP PACKAGES
- Publication number 20070222065
- Publication date Sep 27, 2007
- International Business Machines Corporation
- Paul Stephen Andry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MATERIALS AND METHOD TO SEAL VIAS IN SILICON SUBSTRATES
- Publication number 20060255480
- Publication date Nov 16, 2006
- International Business Machines Corporation
- Jon A. Casey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method to create flexible connections for integrated circuits
- Publication number 20060186540
- Publication date Aug 24, 2006
- International Business Machines Corporation
- Leena Paivikki Buchwalter
- G01 - MEASURING TESTING
Information Patent Application
Centrifugal method for filing high aspect ratio blind micro vias wi...
- Publication number 20060177568
- Publication date Aug 10, 2006
- International Business Machines Corporation
- Gareth Hougham
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Silicon chip carrier with conductive through-vias and method for fa...
- Publication number 20060027934
- Publication date Feb 9, 2006
- International Business Machines Corporation
- Daniel Charles Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip packaging module with active cooling mechanisms
- Publication number 20050168947
- Publication date Aug 4, 2005
- Lawrence Shungwei Mok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Silicon chip carrier with conductive through-vias and method for fa...
- Publication number 20050121768
- Publication date Jun 9, 2005
- International Business Machines Corporation
- Daniel Charles Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Silicon chip carrier with through-vias using laser assisted chemica...
- Publication number 20050082676
- Publication date Apr 21, 2005
- International Business Machines Corporation
- Paul Stephen Andry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Microswitch with a micro-electromechanical system
- Publication number 20040021151
- Publication date Feb 5, 2004
- Telefonaktiebolaget LM Ericsson (publ)
- Michael Meixner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Plasma treatment to enhance inorganic dielectric adhesion to copper
- Publication number 20010053591
- Publication date Dec 20, 2001
- International Business Machines Corporation
- Leena P. Buchwalter
- H01 - BASIC ELECTRIC ELEMENTS

Leena P. Buchwalter

Person

Patents Grantslast 30 patents

Interconnections for flip-chip using lead-free solders and having i...

Low temperature Bi-CMOS compatible process for MEMS RF resonators a...

Laser release process for very thin Si-carrier build

Low temperature Bi-CMOS compatible process for MEMS RF resonators a...

Interconnection for flip-chip using lead-free solders and having im...

Centrifugal method for filing high aspect ratio blind mirco vias po...

Method for precision assembly of integrated circuit chip packages

Method to create flexible connections for integrated circuits

Centrifugal method for filing high aspect ratio blind micro vias wi...

Method for precision assembly of integrated circuit chip packages

Silicon chip carrier with conductive through-vias and method for fa...

Materials and method to seal vias in silicon substrates

Silicon chip carrier with through-vias using laser assisted chemica...

Microswitch with a micro-electromechanical system

Plasma treatment to enhance inorganic dielectric adhesion to copper

Chip interconnect wiring structure with low dielectric constant ins...

Plasma treatment to enhance inorganic dielectric adhesion to copper

Plasma treatment to enhance inorganic dielectric adhesion to copper

Chip interconnect wiring structure with low dielectric constant ins...

Process for producing a metal organic polymer combination

Surface midification of a polyimide

Patents Applicationslast 30 patents

LOW TEMPERATURE BI-CMOS COMPATIBLE PROCESS FOR MEMS RF RESONATORS A...

LASER RELEASE PROCESS FOR VERY THIN SI-CARRIER BUILD

Low Temperature BI-CMOS Compatible Process For MEMS RF Resonators a...

Interconnection for flip-chip using lead-free solders and having im...

Low temperature bi-CMOS compatible process for MEMS RF resonators a...

CENTRIFUGAL METHOD FOR FILING HIGH ASPECT RATIO BLIND MICRO VIAS WI...

LASER RELEASE PROCESS FOR VERY THIN SI-CARRIER BUILD

METHOD TO CREATE FLEXIBLE CONNECTIONS FOR INTEGRATED CIRCUITS

METHOD FOR PRECISION ASSEMBLY OF INTEGRATED CIRCUIT CHIP PACKAGES

INTERCONNECTIONS FOR FLIP-CHIP USING LEAD-FREE SOLDERS AND HAVING I...

Laser release process for very thin Si-carrier build

METHOD TO CREATE FLEXIBLE CONNECTIONS FOR INTEGRATED CIRCUITS

METHOD FOR PRECISION ASSEMBLY OF INTEGRATED CIRCUIT CHIP PACKAGES

MATERIALS AND METHOD TO SEAL VIAS IN SILICON SUBSTRATES

Method to create flexible connections for integrated circuits

Centrifugal method for filing high aspect ratio blind micro vias wi...

Silicon chip carrier with conductive through-vias and method for fa...

Chip packaging module with active cooling mechanisms

Silicon chip carrier with conductive through-vias and method for fa...

Silicon chip carrier with through-vias using laser assisted chemica...

Microswitch with a micro-electromechanical system

Plasma treatment to enhance inorganic dielectric adhesion to copper