Leeshawn Luo

Person

Santa Clara, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Methods and configuration for manufacturing flip chip contact (FCC)...
- Patent number 9,337,132
- Issue date May 10, 2016
- Alpha and Omega Semiconductor Incorporated
- Ming Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip contact (FCC) power package
- Patent number 8,564,049
- Issue date Oct 22, 2013
- Alpha and Omega Semiconductor Incorporated
- Ming Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package for semiconductior devices with improved...
- Patent number 8,169,062
- Issue date May 1, 2012
- Alpha and Omega Semiconductor Incorporated
- Leeshawn Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package for semiconductor devices with improved...
- Patent number 8,067,822
- Issue date Nov 29, 2011
- Alpha and Omega Semiconductor Incorporated
- Leeshawn Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual flat non-leaded semiconductor package
- Patent number 7,951,651
- Issue date May 31, 2011
- Alpha and Omega Semiconductor Incorporated
- Kai Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making semiconductor package with plated connection
- Patent number 7,897,438
- Issue date Mar 1, 2011
- Alpha and Omega Semiconductor Incorporated
- Leeshawn Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inverted J-lead for power devices
- Patent number 7,633,140
- Issue date Dec 15, 2009
- Alpha and Omega Semiconductor Incorporated
- Leeshawn Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with plated connection
- Patent number 7,394,151
- Issue date Jul 1, 2008
- Alpha & Omega Semiconductor Limited
- Leeshawn Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package for semiconductor devices having a reduc...
- Patent number 7,391,100
- Issue date Jun 24, 2008
- Alpha & Omega Semiconductor Limited
- Leeshawn Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor package
- Patent number 7,208,818
- Issue date Apr 24, 2007
- Alpha and Omega Semiconductor Ltd.
- Leeshawn Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High speed switching MOSFETS using multi-parallel die packages with...
- Patent number 7,183,616
- Issue date Feb 27, 2007
- Alpha & Omega Semiconductor, Ltd.
- Anup Bhalla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package for semiconductor devices with improved...
- Patent number 6,841,852
- Issue date Jan 11, 2005
- Leeshawn Luo
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FLIP CHIP CONTACT (FCC) POWER PACKAGE
- Publication number 20150102425
- Publication date Apr 16, 2015
- Ming Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated circuit package for semiconductior devices with improved...
- Publication number 20110221005
- Publication date Sep 15, 2011
- Leeshawn Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL FLAT NON-LEADED SEMICONDUCTOR PACKAGE
- Publication number 20090233403
- Publication date Sep 17, 2009
- Kai Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated circuit package for semiconductior devices with improved...
- Publication number 20090014853
- Publication date Jan 15, 2009
- Leeshawn Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package with plated connection
- Publication number 20080233679
- Publication date Sep 25, 2008
- Alpha and Omega Semiconductor, Inc.
- Leeshawn Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flip chip contact (FCC) power package
- Publication number 20080211070
- Publication date Sep 4, 2008
- Ming Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package with plated connection
- Publication number 20060180931
- Publication date Aug 17, 2006
- Alpha and Omega Semiconductor, Inc.
- Leeshawn Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dual flat non-leaded semiconductor package
- Publication number 20060145312
- Publication date Jul 6, 2006
- Kai Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flip chip contact (FCC) power package
- Publication number 20060145319
- Publication date Jul 6, 2006
- Ming Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power semiconductor package
- Publication number 20060017141
- Publication date Jan 26, 2006
- Leeshawn Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multiple device package
- Publication number 20050280133
- Publication date Dec 22, 2005
- Alpha & Omega Semiconductor
- Leeshawn Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated circuit package for semiconductor devices with improved...
- Publication number 20050145996
- Publication date Jul 7, 2005
- Leeshawn Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Inverted J-lead package for power devices
- Publication number 20050127532
- Publication date Jun 16, 2005
- Leeshawn Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated circuit package for semicoductor devices with improved e...
- Publication number 20040004272
- Publication date Jan 8, 2004
- Leeshawn Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High speed switching mosfets using multi-parallel die packages with...
- Publication number 20030183924
- Publication date Oct 2, 2003
- Alpha & Omega Semiconductor, LTD.
- Anup Bhalla
- H01 - BASIC ELECTRIC ELEMENTS

Leeshawn Luo

Person

Patents Grantslast 30 patents

Methods and configuration for manufacturing flip chip contact (FCC)...

Flip chip contact (FCC) power package

Integrated circuit package for semiconductior devices with improved...

Integrated circuit package for semiconductor devices with improved...

Dual flat non-leaded semiconductor package

Method of making semiconductor package with plated connection

Inverted J-lead for power devices

Semiconductor package with plated connection

Integrated circuit package for semiconductor devices having a reduc...

Power semiconductor package

High speed switching MOSFETS using multi-parallel die packages with...

Integrated circuit package for semiconductor devices with improved...

Patents Applicationslast 30 patents

FLIP CHIP CONTACT (FCC) POWER PACKAGE

Integrated circuit package for semiconductior devices with improved...

DUAL FLAT NON-LEADED SEMICONDUCTOR PACKAGE

Integrated circuit package for semiconductior devices with improved...

Semiconductor package with plated connection

Flip chip contact (FCC) power package

Semiconductor package with plated connection

Dual flat non-leaded semiconductor package

Flip chip contact (FCC) power package

Power semiconductor package

Multiple device package

Integrated circuit package for semiconductor devices with improved...

Inverted J-lead package for power devices

Integrated circuit package for semicoductor devices with improved e...

High speed switching mosfets using multi-parallel die packages with...