Lei-Chun Chou

Person

Taipei City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Metal rail conductors for non-planar semiconductor devices
- Patent number 12,113,132
- Issue date Oct 8, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Liang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Buried metal for FinFET device and method
- Patent number 12,080,588
- Issue date Sep 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Lei-Chun Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device integrating backside power grid and related in...
- Patent number 12,034,076
- Issue date Jul 9, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chih-Liang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for routing local interconnect structure at same level as re...
- Patent number 11,916,077
- Issue date Feb 27, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Liang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device and a semiconductor...
- Patent number 11,848,242
- Issue date Dec 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Li Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Buried metal for FinFET device and method
- Patent number 11,810,811
- Issue date Nov 7, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Lei-Chun Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal rail conductors for non-planar semiconductor devices
- Patent number 11,532,751
- Issue date Dec 20, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Liang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-density semiconductor device
- Patent number 11,532,482
- Issue date Dec 20, 2022
- Taiwan Semiconductor Manufacturing Company Limited
- Lei-Chun Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal rail conductors for non-planar semiconductor devices
- Patent number 11,495,687
- Issue date Nov 8, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Liang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Buried metal for FinFET device and method
- Patent number 11,424,154
- Issue date Aug 23, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Lei-Chun Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device and a semiconductor...
- Patent number 11,289,384
- Issue date Mar 29, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hung-Li Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device integrating backside power grid and related in...
- Patent number 11,121,256
- Issue date Sep 14, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chih-Liang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Local interconnect structure
- Patent number 11,018,157
- Issue date May 25, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Liang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-density semiconductor device
- Patent number 10,950,456
- Issue date Mar 16, 2021
- Taiwan Semiconductor Manufacturing Company Limited
- Lei-Chun Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self aligned via and method for fabricating the same
- Patent number 10,879,120
- Issue date Dec 29, 2020
- TAIWAN SEMICONDUCTOR MANUFACTURING
- Chih-Liang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Buried metal for FinFET device and method
- Patent number 10,867,833
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Lei-Chun Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device and a semiconductor...
- Patent number 10,861,750
- Issue date Dec 8, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hung-Li Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal rail conductors for non-planar semiconductor devices
- Patent number 10,804,402
- Issue date Oct 13, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Liang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal rail conductors for non-planar semiconductor devices
- Patent number 10,763,365
- Issue date Sep 1, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Liang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device integrating backside power grid and related in...
- Patent number 10,700,207
- Issue date Jun 30, 2020
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chih-Liang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-density semiconductor device
- Patent number 10,446,406
- Issue date Oct 15, 2019
- Taiwan Semiconductor Manufacturing Company Limited
- Lei-Chun Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-density semiconductor device
- Patent number 10,032,759
- Issue date Jul 24, 2018
- Taiwan Semiconductor Manufacturing Company Limited
- Chih-Liang Chen
- H03 - BASIC ELECTRONIC CIRCUITRY

Patents Applicationslast 30 patents

Information Patent Application
Metal Rail Conductors For Non-Planar Semiconductor Devices
- Publication number 20240379854
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Liang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Buried Metal for FinFET Device and Method
- Publication number 20240363393
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Lei-Chun Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INTEGRATING BACKSIDE POWER GRID AND RELATED IN...
- Publication number 20240322042
- Publication date Sep 26, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- CHIH-LIANG CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOCAL INTERCONNECT STRUCTURE
- Publication number 20240194682
- Publication date Jun 13, 2024
- Tiawan Semiconductor Manufacturing Co., Ltd.
- Chih-Liang CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND A SEMICONDUCTOR...
- Publication number 20240071834
- Publication date Feb 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Li CHIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Buried Metal for FinFET Device and Method
- Publication number 20230377941
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Lei-Chun Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL RAIL CONDUCTORS FOR NON-PLANAR SEMICONDUCTOR DEVICES
- Publication number 20230091869
- Publication date Mar 23, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Liang CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Buried Metal for FinFET Device and Method
- Publication number 20220367240
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Lei-Chun Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND A SEMICONDUCTOR...
- Publication number 20220216112
- Publication date Jul 7, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Li CHIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INTEGRATING BACKSIDE POWER GRID AND RELATED IN...
- Publication number 20210384351
- Publication date Dec 9, 2021
- Taiwan Semiconductor Manufacturing company Ltd.
- CHIH-LIANG CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOCAL INTERCONNECT STRUCTURE
- Publication number 20210280607
- Publication date Sep 9, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Liang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Buried Metal for FinFET Device and Method
- Publication number 20210193504
- Publication date Jun 24, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Lei-Chun Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High-Density Semiconductor Device
- Publication number 20210166947
- Publication date Jun 3, 2021
- Taiwan Semiconductor Manufacturing Company Limited
- Lei-Chun Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND A SEMICONDUCTOR...
- Publication number 20210118745
- Publication date Apr 22, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hung-Li CHIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL RAIL CONDUCTORS FOR NON-PLANAR SEMICONDUCTOR DEVICES
- Publication number 20210028311
- Publication date Jan 28, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Liang CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL RAIL CONDUCTORS FOR NON-PLANAR SEMICONDUCTOR DEVICES
- Publication number 20200388706
- Publication date Dec 10, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Liang CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INTEGRATING BACKSIDE POWER GRID AND RELATED IN...
- Publication number 20200303551
- Publication date Sep 24, 2020
- Taiwan Semiconductor Manufacturing company Ltd.
- CHIH-LIANG CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High-Density Semiconductor Device
- Publication number 20200043741
- Publication date Feb 6, 2020
- Taiwan Semiconductor Manufacturing Company Limited
- Lei-Chun Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND A SEMICONDUCTOR...
- Publication number 20200006155
- Publication date Jan 2, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hung-Li CHIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Buried Metal for FinFET Device and Method
- Publication number 20190164805
- Publication date May 30, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Lei-Chun Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL RAIL CONDUCTORS FOR NON-PLANAR SEMICONDUCTOR DEVICES
- Publication number 20190165178
- Publication date May 30, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Liang CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL RAIL CONDUCTORS FOR NON-PLANAR SEMICONDUCTOR DEVICES
- Publication number 20190165177
- Publication date May 30, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Liang CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INTEGRATING BACKSIDE POWER GRID AND RELATED IN...
- Publication number 20190164882
- Publication date May 30, 2019
- Taiwan Semiconductor Manufacturing company Ltd.
- CHIH-LIANG CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOCAL INTERCONNECT STRUCTURE
- Publication number 20190096909
- Publication date Mar 28, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Liang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High-Density Semiconductor Device
- Publication number 20180151551
- Publication date May 31, 2018
- Taiwan Semiconductor Manufacturing Company Limited
- Chih-Liang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Self Aligned Via and Method for Fabricating the Same
- Publication number 20180151432
- Publication date May 31, 2018
- Taiwan Semiconductor Manufacturing Company Limited
- Chih-Liang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High-Density Semiconductor Device
- Publication number 20180151381
- Publication date May 31, 2018
- Taiwan Semiconductor Manufacturing Company Limited
- Lei-Chun Chou
- H01 - BASIC ELECTRIC ELEMENTS

Lei-Chun Chou

Person

Patents Grantslast 30 patents

Metal rail conductors for non-planar semiconductor devices

Buried metal for FinFET device and method

Semiconductor device integrating backside power grid and related in...

Method for routing local interconnect structure at same level as re...

Method of manufacturing a semiconductor device and a semiconductor...

Buried metal for FinFET device and method

Metal rail conductors for non-planar semiconductor devices

High-density semiconductor device

Metal rail conductors for non-planar semiconductor devices

Buried metal for FinFET device and method

Method of manufacturing a semiconductor device and a semiconductor...

Semiconductor device integrating backside power grid and related in...

Local interconnect structure

High-density semiconductor device

Self aligned via and method for fabricating the same

Buried metal for FinFET device and method

Method of manufacturing a semiconductor device and a semiconductor...

Metal rail conductors for non-planar semiconductor devices

Metal rail conductors for non-planar semiconductor devices

Semiconductor device integrating backside power grid and related in...

High-density semiconductor device

High-density semiconductor device

Patents Applicationslast 30 patents

Metal Rail Conductors For Non-Planar Semiconductor Devices

Buried Metal for FinFET Device and Method

SEMICONDUCTOR DEVICE INTEGRATING BACKSIDE POWER GRID AND RELATED IN...

LOCAL INTERCONNECT STRUCTURE

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND A SEMICONDUCTOR...

Buried Metal for FinFET Device and Method

METAL RAIL CONDUCTORS FOR NON-PLANAR SEMICONDUCTOR DEVICES

Buried Metal for FinFET Device and Method

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND A SEMICONDUCTOR...

SEMICONDUCTOR DEVICE INTEGRATING BACKSIDE POWER GRID AND RELATED IN...

LOCAL INTERCONNECT STRUCTURE

Buried Metal for FinFET Device and Method

High-Density Semiconductor Device

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND A SEMICONDUCTOR...

METAL RAIL CONDUCTORS FOR NON-PLANAR SEMICONDUCTOR DEVICES

METAL RAIL CONDUCTORS FOR NON-PLANAR SEMICONDUCTOR DEVICES

SEMICONDUCTOR DEVICE INTEGRATING BACKSIDE POWER GRID AND RELATED IN...

High-Density Semiconductor Device

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND A SEMICONDUCTOR...

Buried Metal for FinFET Device and Method

METAL RAIL CONDUCTORS FOR NON-PLANAR SEMICONDUCTOR DEVICES

METAL RAIL CONDUCTORS FOR NON-PLANAR SEMICONDUCTOR DEVICES

SEMICONDUCTOR DEVICE INTEGRATING BACKSIDE POWER GRID AND RELATED IN...

LOCAL INTERCONNECT STRUCTURE

High-Density Semiconductor Device

Self Aligned Via and Method for Fabricating the Same

High-Density Semiconductor Device