Lei Feng

Person

Guangdong, CN

People

Patents Grantslast 30 patents

Information Patent Grant
Temporary carrier and method for manufacturing coreless substrate t...
- Patent number 12,302,508
- Issue date May 13, 2025
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fabrication method for package structure
- Patent number 12,300,511
- Issue date May 13, 2025
- University of Electronic Science and Technology of China
- Xianming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cyclic cooling embedded packaging substrate and manufacturing metho...
- Patent number 12,300,576
- Issue date May 13, 2025
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Support apparatus and foldable electronic device
- Patent number 12,282,357
- Issue date Apr 22, 2025
- HONOR DEVICE CO., LTD.
- Yangjie Tang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Hybrid embedded packaging structure and manufacturing method thereof
- Patent number 12,278,227
- Issue date Apr 15, 2025
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Rotation mechanism, supporting apparatus, and foldable screen terminal
- Patent number 12,271,236
- Issue date Apr 8, 2025
- HONOR DEVICE CO., LTD.
- Lei Feng
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Multi-device graded embedding package substrate and manufacturing m...
- Patent number 12,230,581
- Issue date Feb 18, 2025
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Rotating mechanism, support apparatus, and terminal with foldable s...
- Patent number 12,168,994
- Issue date Dec 17, 2024
- HONOR DEVICE CO., LTD.
- Lei Feng
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Grant
Embedded chip package and manufacturing method thereof
- Patent number 12,148,676
- Issue date Nov 19, 2024
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat dissipation-electromagnetic shielding embedded packaging struc...
- Patent number 12,074,115
- Issue date Aug 27, 2024
- Zhuhai ACCESS Semiconductor Co., Ltd.
- Xianming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connector for implementing multi-faceted interconnection
- Patent number 12,040,272
- Issue date Jul 16, 2024
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing embedded package structure having air reso...
- Patent number 12,040,526
- Issue date Jul 16, 2024
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming Chen
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Circuit prearranged heat dissipation embedded packaging structure a...
- Patent number 12,002,734
- Issue date Jun 4, 2024
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging structure with antenna and manufacturing method thereof
- Patent number 11,984,414
- Issue date May 14, 2024
- Zhuhai ACCESS Semiconductor Co., Ltd.
- Xianming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate manufacturing method for realizing three-dimensional pack...
- Patent number 11,961,743
- Issue date Apr 16, 2024
- Zhuhai ACCESS Semiconductor Co., Ltd.
- Xianming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded structure, manufacturing method thereof and substrate
- Patent number 11,942,465
- Issue date Mar 26, 2024
- Zhuhai ACCESS Semiconductor Co., Ltd.
- Xianming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Combined bio-artificial liver support system
- Patent number 11,911,552
- Issue date Feb 27, 2024
- Southern Medical University Zhujiang Hospital
- Yi Gao
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Structure for embedding and packaging multiple devices by layer and...
- Patent number 11,903,133
- Issue date Feb 13, 2024
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Embedded chip package and manufacturing method thereof
- Patent number 11,854,920
- Issue date Dec 26, 2023
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cavity substrate having directional optoelectronic transmission cha...
- Patent number 11,822,121
- Issue date Nov 21, 2023
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming Chen
- G02 - OPTICS
Information Patent Grant
Package substrate
- Patent number 11,769,733
- Issue date Sep 26, 2023
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connector for implementing multi-faceted interconnection
- Patent number 11,682,621
- Issue date Jun 20, 2023
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cavity substrate having directional optoelectronic transmission cha...
- Patent number 11,579,362
- Issue date Feb 14, 2023
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming Chen
- G02 - OPTICS
Information Patent Grant
Support frame structure and manufacturing method thereof
- Patent number 11,569,177
- Issue date Jan 31, 2023
- Zhuhai ACCESS Semiconductor Co., Ltd.
- Xianming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrate and manufacturing method thereof
- Patent number 11,515,258
- Issue date Nov 29, 2022
- Zhuhai ACCESS Semiconductor Co., Ltd.
- Xianming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Passive device packaging structure embedded in glass medium and met...
- Patent number 11,503,712
- Issue date Nov 15, 2022
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Embedded packaging structure having shielding cavity and manufactur...
- Patent number 11,450,619
- Issue date Sep 20, 2022
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing coreless substrate
- Patent number 11,399,440
- Issue date Jul 26, 2022
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package structure of integrated passive device and manufacturing me...
- Patent number 11,342,273
- Issue date May 24, 2022
- Zhuhai ACCESS Semiconductor Co., Ltd.
- Xianming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer board without feature layer structure and method for man...
- Patent number 11,257,713
- Issue date Feb 22, 2022
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MULTI-DEVICE GRADED EMBEDDING PACKAGE SUBSTRATE AND MANUFACTURING M...
- Publication number 20250149461
- Publication date May 8, 2025
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIBRATION CONTROL METHOD AND APPARATUS, COMPUTER DEVICE, AND STORAG...
- Publication number 20250110562
- Publication date Apr 3, 2025
- Tencent Technology (Shenzhen ) Company Limited
- Shili XU
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SYNCHRONOUS ROTATION MECHANISM AND FOLDABLE ELECTRONIC DEVICE
- Publication number 20240406296
- Publication date Dec 5, 2024
- Honor Device Co., Ltd.
- Lei FENG
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SIDE-EXPOSED EMBEDDED TRACE SUBSTRATE AND MANUFACTURING METHOD THEREOF
- Publication number 20240379504
- Publication date Nov 14, 2024
- Zhuhai YUEXIN Semiconductor Limited Liability Company
- XIANMING CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL FRAME CHIP EMBEDDED PACKAGING SUBSTRATE AND MANUFACTURING MET...
- Publication number 20240312879
- Publication date Sep 19, 2024
- Zhuhai ACCESS Semiconductor Co., Ltd
- XIANMING CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FOLDABLE ASSEMBLY AND ELECTRONIC DEVICE
- Publication number 20240302870
- Publication date Sep 12, 2024
- Honor Device Co., Ltd.
- Lei Feng
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ROTATION MECHANISM, SUPPORTING APPARATUS, AND FOLDABLE SCREEN TERMINAL
- Publication number 20240302868
- Publication date Sep 12, 2024
- Honor Device Co., Ltd.
- Lei FENG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Foldable Electronic Device
- Publication number 20240297929
- Publication date Sep 5, 2024
- Honor Device Co., Ltd.
- Yameng Wei
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
HINGE ASSEMBLY AND TERMINAL PRODUCT
- Publication number 20240271656
- Publication date Aug 15, 2024
- Honor Device Co., Ltd.
- Handong ZHANG
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
HINGE ASSEMBLY AND FOLDABLE ELECTRONIC DEVICE
- Publication number 20240275872
- Publication date Aug 15, 2024
- Honor Device Co., Ltd.
- Hansen ZHENG
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
METHOD FOR PRESENTING ROADING CONDITIONS, ROAD CONDITION PROCESSING...
- Publication number 20240255301
- Publication date Aug 1, 2024
- TENCENT TECHNOLOGY (SHENZHEN) COMPANY LIMITED
- Panpan CUI
- G01 - MEASURING TESTING
Information Patent Application
Support Apparatus and Foldable Electronic Device
- Publication number 20240248512
- Publication date Jul 25, 2024
- Honor Device Co., Ltd.
- Yangjie Tang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
DAMPING MECHANISM AND TERMINAL
- Publication number 20240236217
- Publication date Jul 11, 2024
- Honor Device Co., Ltd.
- Mingqian Gao
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Application
ROTATING MECHANISM, SUPPORT APPARATUS, AND TERMINAL WITH FOLDABLE S...
- Publication number 20240218902
- Publication date Jul 4, 2024
- Honor Device Co., Ltd.
- Lei FENG
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Application
PACKAGED CAVITY STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240116752
- Publication date Apr 11, 2024
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREFOR
- Publication number 20240113031
- Publication date Apr 4, 2024
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Rotation Mechanism and Foldable Terminal
- Publication number 20240098164
- Publication date Mar 21, 2024
- Honor Device Co., Ltd.
- Lei Feng
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
EMBEDDED CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240087972
- Publication date Mar 14, 2024
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD FOR DEVICE EMBEDDED PACKAGING STRUCTURE
- Publication number 20240063055
- Publication date Feb 22, 2024
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING PHOTOSENSITIVE SENSOR STRUCTURE AND MANUFACTURING ME...
- Publication number 20240021740
- Publication date Jan 18, 2024
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GUIDE LINE DISPLAY METHOD AND APPARATUS, DEVICE, AND MEDIUM
- Publication number 20230375358
- Publication date Nov 23, 2023
- TENCENT TECHNOLOGY (SHENZHEN) COMPANY LIMITED
- Chao HAN
- G01 - MEASURING TESTING
Information Patent Application
Electronic Device
- Publication number 20230359251
- Publication date Nov 9, 2023
- Honor Device Co., Ltd.
- Yangjie Tang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
DAMPING ASSEMBLY, ROTATING MECHANISM, AND FOLDABLE TERMINAL
- Publication number 20230358089
- Publication date Nov 9, 2023
- Honor Device Co., Ltd.
- Yameng WEI
- E05 - LOCKS KEYS WINDOW OR DOOR FITTINGS SAFES
Information Patent Application
PACKAGE SUBSTRATE MANUFACTURING METHOD
- Publication number 20230326765
- Publication date Oct 12, 2023
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTOR FOR IMPLEMENTING MULTI-FACETED INTERCONNECTION
- Publication number 20230275023
- Publication date Aug 31, 2023
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE AND MANUFACTURING METHOD THEREOF
- Publication number 20230276576
- Publication date Aug 31, 2023
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A PACKAGING SUBSTRATE, AND PACKAGING SUBST...
- Publication number 20230232545
- Publication date Jul 20, 2023
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CAPACITOR AND INDUCTOR EMBEDDED STRUCTURE AND MANUFACTURING METHOD...
- Publication number 20230197739
- Publication date Jun 22, 2023
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER SUBSTRATE AND MANUFACTURING METHOD THEREFOR
- Publication number 20230199957
- Publication date Jun 22, 2023
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STRUCTURE FOR EMBEDDING AND PACKAGING MULTIPLE DEVICES BY LAYER AND...
- Publication number 20230189444
- Publication date Jun 15, 2023
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Person

Patents Grantslast 30 patents

Temporary carrier and method for manufacturing coreless substrate t...

Fabrication method for package structure

Cyclic cooling embedded packaging substrate and manufacturing metho...

Support apparatus and foldable electronic device

Hybrid embedded packaging structure and manufacturing method thereof

Rotation mechanism, supporting apparatus, and foldable screen terminal

Multi-device graded embedding package substrate and manufacturing m...

Rotating mechanism, support apparatus, and terminal with foldable s...

Embedded chip package and manufacturing method thereof

Heat dissipation-electromagnetic shielding embedded packaging struc...

Connector for implementing multi-faceted interconnection

Method for manufacturing embedded package structure having air reso...

Circuit prearranged heat dissipation embedded packaging structure a...

Packaging structure with antenna and manufacturing method thereof

Substrate manufacturing method for realizing three-dimensional pack...

Embedded structure, manufacturing method thereof and substrate

Combined bio-artificial liver support system

Structure for embedding and packaging multiple devices by layer and...

Embedded chip package and manufacturing method thereof

Cavity substrate having directional optoelectronic transmission cha...

Package substrate

Connector for implementing multi-faceted interconnection

Cavity substrate having directional optoelectronic transmission cha...

Support frame structure and manufacturing method thereof

Package substrate and manufacturing method thereof

Passive device packaging structure embedded in glass medium and met...

Embedded packaging structure having shielding cavity and manufactur...

Method for manufacturing coreless substrate

Package structure of integrated passive device and manufacturing me...

Interposer board without feature layer structure and method for man...

Patents Applicationslast 30 patents

MULTI-DEVICE GRADED EMBEDDING PACKAGE SUBSTRATE AND MANUFACTURING M...

VIBRATION CONTROL METHOD AND APPARATUS, COMPUTER DEVICE, AND STORAG...

SYNCHRONOUS ROTATION MECHANISM AND FOLDABLE ELECTRONIC DEVICE

SIDE-EXPOSED EMBEDDED TRACE SUBSTRATE AND MANUFACTURING METHOD THEREOF

METAL FRAME CHIP EMBEDDED PACKAGING SUBSTRATE AND MANUFACTURING MET...

FOLDABLE ASSEMBLY AND ELECTRONIC DEVICE

ROTATION MECHANISM, SUPPORTING APPARATUS, AND FOLDABLE SCREEN TERMINAL

Foldable Electronic Device

HINGE ASSEMBLY AND TERMINAL PRODUCT

HINGE ASSEMBLY AND FOLDABLE ELECTRONIC DEVICE

METHOD FOR PRESENTING ROADING CONDITIONS, ROAD CONDITION PROCESSING...

Support Apparatus and Foldable Electronic Device

DAMPING MECHANISM AND TERMINAL

ROTATING MECHANISM, SUPPORT APPARATUS, AND TERMINAL WITH FOLDABLE S...

PACKAGED CAVITY STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREFOR

Rotation Mechanism and Foldable Terminal

EMBEDDED CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

MANUFACTURING METHOD FOR DEVICE EMBEDDED PACKAGING STRUCTURE

LIGHT-EMITTING PHOTOSENSITIVE SENSOR STRUCTURE AND MANUFACTURING ME...

GUIDE LINE DISPLAY METHOD AND APPARATUS, DEVICE, AND MEDIUM

Electronic Device

DAMPING ASSEMBLY, ROTATING MECHANISM, AND FOLDABLE TERMINAL

PACKAGE SUBSTRATE MANUFACTURING METHOD

CONNECTOR FOR IMPLEMENTING MULTI-FACETED INTERCONNECTION

PACKAGE SUBSTRATE AND MANUFACTURING METHOD THEREOF

METHOD FOR MANUFACTURING A PACKAGING SUBSTRATE, AND PACKAGING SUBST...

CAPACITOR AND INDUCTOR EMBEDDED STRUCTURE AND MANUFACTURING METHOD...

MULTILAYER SUBSTRATE AND MANUFACTURING METHOD THEREFOR

STRUCTURE FOR EMBEDDING AND PACKAGING MULTIPLE DEVICES BY LAYER AND...