Lei Jiang

Person

Camas, WA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated thermoelectric cooling
- Patent number 10,825,752
- Issue date Nov 3, 2020
- Intel Corporation
- Lei Jiang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power switching circuitry including power-up control
- Patent number 10,333,379
- Issue date Jun 25, 2019
- Intel Corporation
- Suphachai Chai Sutanthavibul
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Rinse apparatus and method for wafer polisher
- Patent number 7,021,999
- Issue date Apr 4, 2006
- Intel Corporation
- Lei Jiang
- B24 - GRINDING POLISHING
Information Patent Grant
Rinse apparatus and method for wafer polisher
- Patent number 6,908,370
- Issue date Jun 21, 2005
- Intel Corporation
- Lei Jiang
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing pad design
- Patent number 6,887,131
- Issue date May 3, 2005
- Intel Corporation
- Lei Jiang
- B24 - GRINDING POLISHING
Information Patent Grant
Minimization of microelectronic interconnect thickness variations
- Patent number 6,883,153
- Issue date Apr 19, 2005
- Intel Corporation
- Lei Jiang
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT STRUCTURES HAVING THROUGH-STACK THERMAL SINK FOR...
- Publication number 20250029892
- Publication date Jan 23, 2025
- Intel Corporation
- Conor P. PULS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL CONDUCTIVITY IN INTEGRATED CIRCUITS
- Publication number 20240419883
- Publication date Dec 19, 2024
- Intel Corporation
- Lei JIANG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHODS AND APPARATUS TO IMPLEMENT THERMAL GRADIENT PROJECTION AND...
- Publication number 20240370615
- Publication date Nov 7, 2024
- Intel Corporation
- Lei Jiang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
THERMAL MANAGEMENT OF BASE DIES IN MULTICHIP COMPOSITE DEVICES
- Publication number 20240063089
- Publication date Feb 22, 2024
- Intel Corporation
- Adel Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ARCHITECTURE FOR QUASI-MONOLITHIC CHIP WITH BACKSIDE POWER
- Publication number 20240063120
- Publication date Feb 22, 2024
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY ENHANCED STRUCTURAL MEMBER AND/OR BOND LAYER FOR MULTICHI...
- Publication number 20240063091
- Publication date Feb 22, 2024
- Intel Corporation
- Adel Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL MANAGEMENT STRUCTURES IN SEMICONDUCTOR DEVICES AND METHODS...
- Publication number 20220415807
- Publication date Dec 29, 2022
- Intel Corporation
- Chytra Pawashe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SWITCHING CIRCUITRY INCLUDING POWER-UP CONTROL
- Publication number 20180175832
- Publication date Jun 21, 2018
- Suphachai Chai Sutanthavibul
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
Ultrasonic electropolishing of conductive material
- Publication number 20080213995
- Publication date Sep 4, 2008
- Tatyana N. Andryushchenko
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Copper containing abrasive particles to modify reactivity and perfo...
- Publication number 20060138087
- Publication date Jun 29, 2006
- Harsono S. Simka
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Rinse apparatus and method for wafer polisher
- Publication number 20050181709
- Publication date Aug 18, 2005
- Lei Jiang
- B24 - GRINDING POLISHING
Information Patent Application
RINSE APPARATUS AND METHOD FOR WAFER POLISHER
- Publication number 20050124267
- Publication date Jun 9, 2005
- Lei Jiang
- B24 - GRINDING POLISHING
Information Patent Application
Using benzocyclobutene based polymers as underfill materials
- Publication number 20050054143
- Publication date Mar 10, 2005
- Sergei Skokov
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Using benzocyclobutene based polymers as underfill materials
- Publication number 20040159923
- Publication date Aug 19, 2004
- Sergei Skokov
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Minimization of microelectronic interconnect thickness variations
- Publication number 20040139419
- Publication date Jul 15, 2004
- Lei Jiang
- B24 - GRINDING POLISHING
Information Patent Application
Polishing pad design
- Publication number 20040043698
- Publication date Mar 4, 2004
- Lei Jiang
- B24 - GRINDING POLISHING

Person

Patents Grantslast 30 patents

Integrated thermoelectric cooling

Power switching circuitry including power-up control

Rinse apparatus and method for wafer polisher

Rinse apparatus and method for wafer polisher

Polishing pad design

Minimization of microelectronic interconnect thickness variations

Patents Applicationslast 30 patents

INTEGRATED CIRCUIT STRUCTURES HAVING THROUGH-STACK THERMAL SINK FOR...

THERMAL CONDUCTIVITY IN INTEGRATED CIRCUITS

METHODS AND APPARATUS TO IMPLEMENT THERMAL GRADIENT PROJECTION AND...

THERMAL MANAGEMENT OF BASE DIES IN MULTICHIP COMPOSITE DEVICES

PACKAGE ARCHITECTURE FOR QUASI-MONOLITHIC CHIP WITH BACKSIDE POWER

THERMALLY ENHANCED STRUCTURAL MEMBER AND/OR BOND LAYER FOR MULTICHI...

THERMAL MANAGEMENT STRUCTURES IN SEMICONDUCTOR DEVICES AND METHODS...

POWER SWITCHING CIRCUITRY INCLUDING POWER-UP CONTROL

Ultrasonic electropolishing of conductive material

Copper containing abrasive particles to modify reactivity and perfo...

Rinse apparatus and method for wafer polisher

RINSE APPARATUS AND METHOD FOR WAFER POLISHER

Using benzocyclobutene based polymers as underfill materials

Using benzocyclobutene based polymers as underfill materials

Minimization of microelectronic interconnect thickness variations

Polishing pad design