Lei LI

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Plano, TX, US

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Patents Grantslast 30 patents

Information Patent Grant
System and method for multi-SIM profiles or embedded SIM
- Patent number 10,237,722
- Issue date Mar 19, 2019
- FutureWei Technologies, Inc.
- Jian Chen
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Method and apparatus for establishing SSID-based connection between...
- Patent number 9,949,116
- Issue date Apr 17, 2018
- Huawei Device Co., Ltd.
- Lei Li
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Patents Applicationslast 30 patents

Information Patent Application
System and Method for Multi-SIM Profiles or Embedded SIM
- Publication number 20200084612
- Publication date Mar 12, 2020
- FutureWei Technologies, Inc.
- Jian CHEN
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
METHOD AND APPARATUS FOR INTERCONNECTION BETWEEN TERMINAL DEVICE AN...
- Publication number 20160373925
- Publication date Dec 22, 2016
- HUAWEI DEVICE CO., LTD.
- Lei LI
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
System and Method for Multi-SIM Profiles or Embedded SIM
- Publication number 20160269891
- Publication date Sep 15, 2016
- FutureWei Technologies, Inc.
- Jian CHEN
- H04 - ELECTRIC COMMUNICATION TECHNIQUE