Lei Lian

Person

Freemont, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Etch feedback for control of upstream process
- Patent number 12,237,158
- Issue date Feb 25, 2025
- Applied Materials, Inc.
- Priyadarshi Panda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etalon thermometry for plasma environments
- Patent number 12,078,547
- Issue date Sep 3, 2024
- Applied Materials, Inc.
- Bruce E. Adams
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adjustable achromatic collimator assembly for endpoint detection sy...
- Patent number 12,066,639
- Issue date Aug 20, 2024
- Applied Materials, Inc.
- Pengyu Han
- G02 - OPTICS
Information Patent Grant
Endpoint detection in low open area and/or high aspect ratio etch a...
- Patent number 12,046,522
- Issue date Jul 23, 2024
- Applied Materials, Inc.
- Lei Lian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Endpoint detection system for enhanced spectral data collection
- Patent number 11,965,798
- Issue date Apr 23, 2024
- Applied Materials, Inc.
- Pengyu Han
- G01 - MEASURING TESTING
Information Patent Grant
Substrate process endpoint detection using machine learning
- Patent number 11,901,203
- Issue date Feb 13, 2024
- Applied Materials, Inc.
- Pengyu Han
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
In-situ optical chamber surface and process sensor
- Patent number 11,735,401
- Issue date Aug 22, 2023
- Applied Materials, Inc.
- Chuang-Chia Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adjustable achromatic collimator assembly for endpoint detection sy...
- Patent number 11,719,952
- Issue date Aug 8, 2023
- Applied Materials, Inc.
- Pengyu Han
- G02 - OPTICS
Information Patent Grant
Autonomous substrate processing system
- Patent number 11,709,477
- Issue date Jul 25, 2023
- Applied Materials, Inc.
- Priyadarshi Panda
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Eliminating internal reflections in an interferometric endpoint det...
- Patent number 11,421,977
- Issue date Aug 23, 2022
- Applied Materials, Inc.
- Lei Lian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
In-situ optical chamber surface and process sensor
- Patent number 11,114,286
- Issue date Sep 7, 2021
- Applied Materials, Inc.
- Chuang-Chia Lin
- G01 - MEASURING TESTING
Information Patent Grant
3D NAND staircase CD control by using interferometric endpoint dete...
- Patent number 9,601,396
- Issue date Mar 21, 2017
- Applied Materials, Inc.
- Lei Lian
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
3D NAND staircase CD control by using interferometric endpoint dete...
- Patent number 9,240,359
- Issue date Jan 19, 2016
- Applied Materials, Inc.
- Lei Lian
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Pulsed plasma monitoring using optical sensor and a signal analyzer...
- Patent number 9,200,950
- Issue date Dec 1, 2015
- Applied Materials, Inc.
- Lei Lian
- G01 - MEASURING TESTING
Information Patent Grant
Embedded test structure for trimming process control
- Patent number 8,956,886
- Issue date Feb 17, 2015
- Applied Materials, Inc.
- Samer Banna
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Method and apparatus for in-situ metrology of a workpiece disposed...
- Patent number 8,274,645
- Issue date Sep 25, 2012
- Applied Materials, Inc.
- Matthew F. Davis
- G01 - MEASURING TESTING
Information Patent Grant
Method and system for monitoring an etch process
- Patent number 8,257,546
- Issue date Sep 4, 2012
- Applied Materials, Inc.
- Matthew Fenton Davis
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Within-sequence metrology based process tuning for adaptive self-al...
- Patent number 8,232,212
- Issue date Jul 31, 2012
- Applied Materials, Inc.
- Matthew F. Davis
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Determining endpoint in a substrate process
- Patent number 8,130,382
- Issue date Mar 6, 2012
- Applied Materials, Inc.
- Lei Lian
- G01 - MEASURING TESTING
Information Patent Grant
Advanced process sensing and control using near infrared spectral r...
- Patent number 8,009,938
- Issue date Aug 30, 2011
- Applied Materials, Inc.
- Matthew Fenton Davis
- G01 - MEASURING TESTING
Information Patent Grant
Determining endpoint in a substrate process
- Patent number 7,969,581
- Issue date Jun 28, 2011
- Applied Materials, Inc.
- Lei Lian
- G01 - MEASURING TESTING
Information Patent Grant
Method for controlling a process for fabricating integrated devices
- Patent number 7,815,812
- Issue date Oct 19, 2010
- Applied Materials, Inc.
- Matthew F. Davis
- G05 - CONTROLLING REGULATING
Information Patent Grant
Determining endpoint in a substrate process
- Patent number 7,808,651
- Issue date Oct 5, 2010
- Applied Materials, Inc.
- Lei Lian
- G01 - MEASURING TESTING
Information Patent Grant
Method for automatic determination of semiconductor plasma chamber...
- Patent number 7,695,987
- Issue date Apr 13, 2010
- Applied Materils, Inc.
- Matthew F. Davis
- G01 - MEASURING TESTING
Information Patent Grant
Interferometric endpoint determination in a substrate etching process
- Patent number 7,652,774
- Issue date Jan 26, 2010
- Applied Materials, Inc.
- Lei Lian
- G01 - MEASURING TESTING
Information Patent Grant
Method and apparatus for performing limited area spectral analysis
- Patent number 7,602,484
- Issue date Oct 13, 2009
- Applied Materials, Inc.
- Matthew F. Davis
- G01 - MEASURING TESTING
Information Patent Grant
Method for automatic determination of substrates states in plasma p...
- Patent number 7,393,459
- Issue date Jul 1, 2008
- Applied Materials, Inc.
- Matthew F Davis
- G01 - MEASURING TESTING
Information Patent Grant
Method and apparatus for performing limited area spectral analysis
- Patent number 7,330,244
- Issue date Feb 12, 2008
- Applied Materials, Inc.
- Matthew F. Davis
- G01 - MEASURING TESTING
Information Patent Grant
Interferometric endpoint determination in a substrate etching process
- Patent number 7,306,696
- Issue date Dec 11, 2007
- Applied Materials, Inc.
- Lei Lian
- G01 - MEASURING TESTING
Information Patent Grant
Method for automatic determination of semiconductor plasma chamber...
- Patent number 7,169,625
- Issue date Jan 30, 2007
- Applied Materials, Inc.
- Matthew F. Davis
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
ETALON THERMOMETRY FOR PLASMA ENVIRONMENTS
- Publication number 20240385048
- Publication date Nov 21, 2024
- Applied Materials, Inc.
- Bruce E. ADAMS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENDPOINT DETECTION IN LOW OPEN AREA AND/OR HIGH ASPECT RATIO ETCH A...
- Publication number 20240379469
- Publication date Nov 14, 2024
- Applied Materials, Inc.
- Lei LIAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENDPOINT DETECTION SYSTEM FOR ENHANCED SPECTRAL DATA COLLECTION
- Publication number 20240230462
- Publication date Jul 11, 2024
- Applied Materials, Inc.
- Pengyu Han
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
ADJUSTABLE ACHROMATIC COLLIMATOR ASSEMBLY FOR ENDPOINT DETECTION SY...
- Publication number 20230341699
- Publication date Oct 26, 2023
- Applied Materials, Inc.
- Pengyu Han
- G02 - OPTICS
Information Patent Application
AUTONOMOUS SUBSTRATE PROCESSING SYSTEM
- Publication number 20230305531
- Publication date Sep 28, 2023
- Applied Materials, Inc.
- Priyadarshi Panda
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ENDPOINT DETECTION IN LOW OPEN AREA AND/OR HIGH ASPECT RATIO ETCH A...
- Publication number 20230268235
- Publication date Aug 24, 2023
- Applied Materials, Inc.
- Lei LIAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETALON THERMOMETRY FOR PLASMA ENVIRONMENTS
- Publication number 20230102821
- Publication date Mar 30, 2023
- Applied Materials, Inc.
- Bruce E. ADAMS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENDPOINT DETECTION SYSTEM FOR ENHANCED SPECTRAL DATA COLLECTION
- Publication number 20220397482
- Publication date Dec 15, 2022
- Applied Materials, Inc.
- Pengyu Han
- G01 - MEASURING TESTING
Information Patent Application
SUBSTRATE PROCESS ENDPOINT DETECTION USING MACHINE LEARNING
- Publication number 20220399215
- Publication date Dec 15, 2022
- Applied Materials, Inc.
- Pengyu Han
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
OBTAINING SUBSTRATE METROLOGY MEASUREMENT VALUES USING MACHINE LEAR...
- Publication number 20220397515
- Publication date Dec 15, 2022
- Applied Materials, Inc.
- Pengyu Han
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
AUTONOMOUS SUBSTRATE PROCESSING SYSTEM
- Publication number 20220214662
- Publication date Jul 7, 2022
- Applied Materials, Inc.
- Priyadarshi Panda
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ETCH FEEDBACK FOR CONTROL OF UPSTREAM PROCESS
- Publication number 20220165541
- Publication date May 26, 2022
- Applied Materials, Inc.
- Priyadarshi Panda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FEEDFORWARD CONTROL OF MULTI-LAYER STACKS DURING DEVICE FABRICATION
- Publication number 20220165593
- Publication date May 26, 2022
- Applied Materials, Inc.
- Priyadarshi Panda
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
OPTICAL CABLE FOR INTERFEROMETRIC ENDPOINT DETECTION
- Publication number 20220148862
- Publication date May 12, 2022
- Applied Materials, Inc.
- Lei LIAN
- G01 - MEASURING TESTING
Information Patent Application
ADJUSTABLE ACHROMATIC COLLIMATOR ASSEMBLY FOR ENDPOINT DETECTION SY...
- Publication number 20220050303
- Publication date Feb 17, 2022
- Applied Materials, Inc.
- Pengyu Han
- G02 - OPTICS
Information Patent Application
IN-SITU OPTICAL CHAMBER SURFACE AND PROCESS SENSOR
- Publication number 20210398785
- Publication date Dec 23, 2021
- Applied Materials, Inc.
- Chuang-Chia Lin
- G01 - MEASURING TESTING
Information Patent Application
IN-SITU OPTICAL CHAMBER SURFACE AND PROCESS SENSOR
- Publication number 20200321201
- Publication date Oct 8, 2020
- Applied Materials, Inc.
- Chuang-Chia Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELIMINATING INTERNAL REFLECTIONS IN AN INTERFEROMETRIC ENDPOINT DET...
- Publication number 20200124399
- Publication date Apr 23, 2020
- APPLIED MATERIALS, INC.
- Lei LIAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TILTED INTERFEROMETRIC ENDPOINT (IEP) WINDOW FOR SENSITIVITY IMPROV...
- Publication number 20200013588
- Publication date Jan 9, 2020
- Applied Materials, Inc.
- Lei LIAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D NAND STAIRCASE CD CONTROL BY USING INTERFEROMETRIC ENDPOINT DETE...
- Publication number 20160099187
- Publication date Apr 7, 2016
- Applied Materials, Inc.
- Lei LIAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Pulsed Plasma Monitoring Using Optical Sensor
- Publication number 20150241272
- Publication date Aug 27, 2015
- Lei Lian
- G01 - MEASURING TESTING
Information Patent Application
3D NAND STAIRCASE CD CONTROL BY USING INTERFEROMETRIC ENDPOINT DETE...
- Publication number 20150011027
- Publication date Jan 8, 2015
- Applied Materials, Inc.
- Lei LIAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED TEST STRUCTURE FOR TRIMMING PROCESS CONTROL
- Publication number 20140273297
- Publication date Sep 18, 2014
- Applied Materials, Inc.
- SAMER BANNA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ROTATIONAL ABSORPTION SPECTRA FOR SEMICONDUCTOR MANUFACTURING PROCE...
- Publication number 20130309785
- Publication date Nov 21, 2013
- Applied Materials, Inc.
- ZHIFENG SUI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND SYSTEM FOR MONITORING AN ETCH PROCESS
- Publication number 20120291952
- Publication date Nov 22, 2012
- Matthew Fenton Davis
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
DETERMINING ENDPOINT IN A SUBSTRATE PROCESS
- Publication number 20110253671
- Publication date Oct 20, 2011
- Applied Materials, Inc.
- Lei Lian
- G01 - MEASURING TESTING
Information Patent Application
DETERMINING ENDPOINT IN A SUBSTRATE PROCESS
- Publication number 20110019201
- Publication date Jan 27, 2011
- Applied Materials, Inc.
- Lei Lian
- G01 - MEASURING TESTING
Information Patent Application
METHOD AND APPARATUS FOR IN-SITU METROLOGY OF A WORKPIECE DISPOSED...
- Publication number 20110013175
- Publication date Jan 20, 2011
- Matthew F. Davis
- G01 - MEASURING TESTING
Information Patent Application
DETERMINING ENDPOINT IN A SUBSTRATE PROCESS
- Publication number 20100133232
- Publication date Jun 3, 2010
- Applied Materials, Inc.
- Lei Lian
- G01 - MEASURING TESTING
Information Patent Application
SELF-DIAGNOSTIC SEMICONDUCTOR EQUIPMENT
- Publication number 20100076729
- Publication date Mar 25, 2010
- Applied Materials, Inc.
- MATTHEW F. DAVIS
- G05 - CONTROLLING REGULATING

Person

Patents Grantslast 30 patents

Etch feedback for control of upstream process

Etalon thermometry for plasma environments

Adjustable achromatic collimator assembly for endpoint detection sy...

Endpoint detection in low open area and/or high aspect ratio etch a...

Endpoint detection system for enhanced spectral data collection

Substrate process endpoint detection using machine learning

In-situ optical chamber surface and process sensor

Adjustable achromatic collimator assembly for endpoint detection sy...

Autonomous substrate processing system

Eliminating internal reflections in an interferometric endpoint det...

In-situ optical chamber surface and process sensor

3D NAND staircase CD control by using interferometric endpoint dete...

3D NAND staircase CD control by using interferometric endpoint dete...

Pulsed plasma monitoring using optical sensor and a signal analyzer...

Embedded test structure for trimming process control

Method and apparatus for in-situ metrology of a workpiece disposed...

Method and system for monitoring an etch process

Within-sequence metrology based process tuning for adaptive self-al...

Determining endpoint in a substrate process

Advanced process sensing and control using near infrared spectral r...

Determining endpoint in a substrate process

Method for controlling a process for fabricating integrated devices

Determining endpoint in a substrate process

Method for automatic determination of semiconductor plasma chamber...

Interferometric endpoint determination in a substrate etching process

Method and apparatus for performing limited area spectral analysis

Method for automatic determination of substrates states in plasma p...

Method and apparatus for performing limited area spectral analysis

Interferometric endpoint determination in a substrate etching process

Method for automatic determination of semiconductor plasma chamber...

Patents Applicationslast 30 patents

ETALON THERMOMETRY FOR PLASMA ENVIRONMENTS

ENDPOINT DETECTION IN LOW OPEN AREA AND/OR HIGH ASPECT RATIO ETCH A...

ENDPOINT DETECTION SYSTEM FOR ENHANCED SPECTRAL DATA COLLECTION

ADJUSTABLE ACHROMATIC COLLIMATOR ASSEMBLY FOR ENDPOINT DETECTION SY...

AUTONOMOUS SUBSTRATE PROCESSING SYSTEM

ENDPOINT DETECTION IN LOW OPEN AREA AND/OR HIGH ASPECT RATIO ETCH A...

ETALON THERMOMETRY FOR PLASMA ENVIRONMENTS

ENDPOINT DETECTION SYSTEM FOR ENHANCED SPECTRAL DATA COLLECTION

SUBSTRATE PROCESS ENDPOINT DETECTION USING MACHINE LEARNING

OBTAINING SUBSTRATE METROLOGY MEASUREMENT VALUES USING MACHINE LEAR...

AUTONOMOUS SUBSTRATE PROCESSING SYSTEM

ETCH FEEDBACK FOR CONTROL OF UPSTREAM PROCESS

FEEDFORWARD CONTROL OF MULTI-LAYER STACKS DURING DEVICE FABRICATION

OPTICAL CABLE FOR INTERFEROMETRIC ENDPOINT DETECTION

ADJUSTABLE ACHROMATIC COLLIMATOR ASSEMBLY FOR ENDPOINT DETECTION SY...

IN-SITU OPTICAL CHAMBER SURFACE AND PROCESS SENSOR

IN-SITU OPTICAL CHAMBER SURFACE AND PROCESS SENSOR

ELIMINATING INTERNAL REFLECTIONS IN AN INTERFEROMETRIC ENDPOINT DET...

TILTED INTERFEROMETRIC ENDPOINT (IEP) WINDOW FOR SENSITIVITY IMPROV...

3D NAND STAIRCASE CD CONTROL BY USING INTERFEROMETRIC ENDPOINT DETE...

Pulsed Plasma Monitoring Using Optical Sensor

3D NAND STAIRCASE CD CONTROL BY USING INTERFEROMETRIC ENDPOINT DETE...

EMBEDDED TEST STRUCTURE FOR TRIMMING PROCESS CONTROL

ROTATIONAL ABSORPTION SPECTRA FOR SEMICONDUCTOR MANUFACTURING PROCE...

METHOD AND SYSTEM FOR MONITORING AN ETCH PROCESS

DETERMINING ENDPOINT IN A SUBSTRATE PROCESS

DETERMINING ENDPOINT IN A SUBSTRATE PROCESS

METHOD AND APPARATUS FOR IN-SITU METROLOGY OF A WORKPIECE DISPOSED...

DETERMINING ENDPOINT IN A SUBSTRATE PROCESS

SELF-DIAGNOSTIC SEMICONDUCTOR EQUIPMENT