Lei Tie

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Suzhou, CN

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Patents Grantslast 30 patents

Information Patent Grant
Coaxial and cluster connector assemblies
- Patent number 11,637,387
- Issue date Apr 25, 2023
- CommScope Technologies LLC
- JianPing Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bayonet-type bundled RF connector assembly
- Patent number 11,581,679
- Issue date Feb 14, 2023
- CommScope Technologies LLC
- Lei Tie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coaxial connector and board-to-board connector assembly
- Patent number 11,411,347
- Issue date Aug 9, 2022
- CommScope Technologies LLC
- JianPing Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bayonet-type bundled RF connector assembly
- Patent number 11,108,192
- Issue date Aug 31, 2021
- CommScope Technologies LLC
- Lei Tie
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
COAXIAL CONNECTOR ASSEMBLIES
- Publication number 20220029316
- Publication date Jan 27, 2022
- CommScope Technologies LLC
- JianPing Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BAYONET-TYPE BUNDLED RF CONNECTOR ASSEMBLY
- Publication number 20210376521
- Publication date Dec 2, 2021
- CommScope Technologies LLC
- Lei Tie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COAXIAL CONNECTOR AND BOARD-TO-BOARD CONNECTOR ASSEMBLY
- Publication number 20210143581
- Publication date May 13, 2021
- CommScope Technologies LLC
- JianPing Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BAYONET-TYPE BUNDLED RF CONNECTOR ASSEMBLY
- Publication number 20210013671
- Publication date Jan 14, 2021
- CommScope Technologies LLC
- Lei Tie
- H01 - BASIC ELECTRIC ELEMENTS