Lei Wei

Person

Boise, ID, US

People

Patents Grantslast 30 patents

Information Patent Grant
Multitier arrangements of integrated devices, and methods of formin...
- Patent number 12,144,188
- Issue date Nov 12, 2024
- Micron Technology, Inc.
- Lei Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Efficient fabrication of memory structures
- Patent number 12,082,425
- Issue date Sep 3, 2024
- Micron Technology, Inc.
- Don Koun Lee
Information Patent Grant
Reduced resistivity for access lines in a memory array
- Patent number 11,830,816
- Issue date Nov 28, 2023
- Micron Technology, Inc.
- Lei Wei
- G11 - INFORMATION STORAGE
Information Patent Grant
Memory with optimized resistive layers
- Patent number 11,778,837
- Issue date Oct 3, 2023
- Micron Technology, Inc.
- Lei Wei
Information Patent Grant
Efficient fabrication of memory structures
- Patent number 11,626,452
- Issue date Apr 11, 2023
- Micron Technology, Inc.
- Don Koun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory arrays, and methods of forming the same
- Patent number 11,616,098
- Issue date Mar 28, 2023
- Micron Technology, Inc.
- Lingming Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multitier arrangements of integrated devices, and methods of formin...
- Patent number 11,600,666
- Issue date Mar 7, 2023
- Micron Technology, Inc.
- Lei Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory with optimized resistive layers
- Patent number 11,380,732
- Issue date Jul 5, 2022
- Micron Technology, Inc.
- Lei Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sense lines in three-dimensional memory arrays, and methods of form...
- Patent number 11,355,554
- Issue date Jun 7, 2022
- Micron Technology, Inc.
- Lingming Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multitier arrangements of integrated devices, and methods of formin...
- Patent number 10,957,741
- Issue date Mar 23, 2021
- Micron Technology, Inc.
- Lei Wei
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
REDUCED RESISTIVITY FOR ACCESS LINES IN A MEMORY ARRAY
- Publication number 20240162156
- Publication date May 16, 2024
- Micron Technology, Inc.
- Lei Wei
- G11 - INFORMATION STORAGE
Information Patent Application
Memory Circuitry Comprising Strings Of Memory Cells
- Publication number 20230317800
- Publication date Oct 5, 2023
- Micron Technology, Inc.
- Dhirendra Dhananjay Vaidya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EFFICIENT FABRICATION OF MEMORY STRUCTURES
- Publication number 20230225137
- Publication date Jul 13, 2023
- Micron Technology, Inc.
- Don Koun Lee
Information Patent Application
Multitier Arrangements of Integrated Devices, and Methods of Formin...
- Publication number 20230165017
- Publication date May 25, 2023
- Micron Technology, Inc.
- Lei Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY WITH OPTIMIZED RESISTIVE LAYERS
- Publication number 20220406847
- Publication date Dec 22, 2022
- Micron Technology, Inc.
- Lei Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY ARRAYS, AND METHODS OF FORMING THE SAME
- Publication number 20220302212
- Publication date Sep 22, 2022
- Micron Technology, Inc.
- Lingming Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCED RESISTIVITY FOR ACCESS LINES IN A MEMORY ARRAY
- Publication number 20220051984
- Publication date Feb 17, 2022
- Micron Technology, Inc.
- Lei Wei
- G11 - INFORMATION STORAGE
Information Patent Application
MEMORY WITH OPTIMIZED RESISTIVE LAYERS
- Publication number 20220037403
- Publication date Feb 3, 2022
- Micron Technology, Inc.
- Lei Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EFFICIENT FABRICATION OF MEMORY STRUCTURES
- Publication number 20220037402
- Publication date Feb 3, 2022
- Micron Technology, Inc.
- Don Koun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY ARRAYS, AND METHODS OF FORMING THE SAME
- Publication number 20210351234
- Publication date Nov 11, 2021
- Micron Technology, Inc.
- Lingming Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multitier Arrangements of Integrated Devices, and Methods of Formin...
- Publication number 20210167132
- Publication date Jun 3, 2021
- Micron Technology, Inc.
- Lei Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multitier Arrangements of Integrated Devices, and Methods of Formin...
- Publication number 20200350370
- Publication date Nov 5, 2020
- Micron Technology, Inc.
- Lei Wei
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Multitier arrangements of integrated devices, and methods of formin...

Efficient fabrication of memory structures

Reduced resistivity for access lines in a memory array

Memory with optimized resistive layers

Efficient fabrication of memory structures

Three-dimensional memory arrays, and methods of forming the same

Multitier arrangements of integrated devices, and methods of formin...

Memory with optimized resistive layers

Sense lines in three-dimensional memory arrays, and methods of form...

Multitier arrangements of integrated devices, and methods of formin...

Patents Applicationslast 30 patents

REDUCED RESISTIVITY FOR ACCESS LINES IN A MEMORY ARRAY

Memory Circuitry Comprising Strings Of Memory Cells

EFFICIENT FABRICATION OF MEMORY STRUCTURES

Multitier Arrangements of Integrated Devices, and Methods of Formin...

MEMORY WITH OPTIMIZED RESISTIVE LAYERS

THREE-DIMENSIONAL MEMORY ARRAYS, AND METHODS OF FORMING THE SAME

REDUCED RESISTIVITY FOR ACCESS LINES IN A MEMORY ARRAY

MEMORY WITH OPTIMIZED RESISTIVE LAYERS

EFFICIENT FABRICATION OF MEMORY STRUCTURES

THREE-DIMENSIONAL MEMORY ARRAYS, AND METHODS OF FORMING THE SAME

Multitier Arrangements of Integrated Devices, and Methods of Formin...

Multitier Arrangements of Integrated Devices, and Methods of Formin...