Lei YANG

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Hefei, CN

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Patents Grantslast 30 patents

Information Patent Grant
Ceramic package for quantum computing and method for preparation
- Patent number 12,128,652
- Issue date Oct 29, 2024
- HEFEI SHENGDA ELECTRONICS TECHNOLOGY INDUSTRY CO., LTD
- Dong Feng
- B32 - LAYERED PRODUCTS
Information Patent Grant
Methods for partial gold plating of metal packaging housings and pa...
- Patent number 11,725,294
- Issue date Aug 15, 2023
- HEFEI SHENGDA ELECTRONICS TECHNOLOGY INDUSTRY CO., LTD
- Xiao Ma
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
CERAMIC PACKAGE FOR QUANTUM COMPUTING AND METHOD FOR PREPARATION
- Publication number 20240300219
- Publication date Sep 12, 2024
- HEFEI SHENGDA ELECTRONICS TECHNOLOGY INDUSTRY CO., LTD.
- Dong FENG
- B32 - LAYERED PRODUCTS
Information Patent Application
METHODS FOR PARTIAL GOLD PLATING OF METAL PACKAGING HOUSINGS AND PA...
- Publication number 20230175157
- Publication date Jun 8, 2023
- HEFEI SHENGDA ELECTRONICS TECHNOLOGY INDUSTRY CO., LTD.
- Xiao MA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR