TREA

LEI YAO

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  • Shenzhen, CN
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Patents Applicationslast 30 patents

  • Information Patent Application

    COMBINATION THERMAL MODULE AND WICK STRUCTURE THEREOF
    • Publication number 20250146763
    • Publication date May 8, 2025
    • ASIA VITAL COMPONENTS (CHINA) CO., LTD.
    • XIWEN XIONG
    • F28 - HEAT EXCHANGE IN GENERAL
  • Information Patent Application

    COMBINATION HEAT DISSIPATION STRUCTURE
    • Publication number 20250146762
    • Publication date May 8, 2025
    • ASIA VITAL COMPONENTS (CHINA) CO., LTD.
    • XIWEN XIONG
    • F28 - HEAT EXCHANGE IN GENERAL
  • Information Patent Application

    COMBINATION HEAT DISSIPATION UNIT
    • Publication number 20250151231
    • Publication date May 8, 2025
    • ASIA VITAL COMPONENTS (CHINA) CO., LTD.
    • XIWEN XIONG
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR