LEI YE

Person

  • Shanghai, CN

Patents Grantslast 30 patents

  • Information Patent Grant

    3D NAND device

    • Patent number 10,763,275
    • Issue date Sep 1, 2020
    • Semiconductor Manufacturing International (Shanghai) Corporation
    • Huayong Hu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    3D NAND device and fabrication method thereof

    • Patent number 9,711,529
    • Issue date Jul 18, 2017
    • Semiconductor Manufacturing International (Shanghai) Corporation
    • Huayong Hu
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

  • Information Patent Application

    3D NAND DEVICE

    • Publication number 20170278864
    • Publication date Sep 28, 2017
    • Semiconductor Manufacturing International (Shanghai) Corporation
    • HUAYONG HU
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    3D NAND DEVICE AND FABRICATION METHOD THEREOF

    • Publication number 20160329345
    • Publication date Nov 10, 2016
    • Semiconductor Manufacturing International (Shanghai) Corporation
    • HUAYONG HU
    • H01 - BASIC ELECTRIC ELEMENTS