Leigh M. TRIBOLET

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Chandler, AZ, US

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Patents Grantslast 30 patents

Information Patent Grant
Multi-die ultrafine pitch patch architecture of interconnect bridge...
- Patent number 12,142,568
- Issue date Nov 12, 2024
- Intel Corporation
- Sanka Ganesan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultrathin bridge and multi-die ultrafine pitch patch architecture a...
- Patent number 11,756,889
- Issue date Sep 12, 2023
- Intel Corporation
- Sanka Ganesan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-die ultrafine pitch patch architecture and method of making
- Patent number 11,694,959
- Issue date Jul 4, 2023
- Intel Corporation
- Sanka Ganesan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Constrained cure component attach process for improved IC package w...
- Patent number 10,290,569
- Issue date May 14, 2019
- Intel Corporation
- Kyle Yazzie
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
MULTI-DIE ULTRAFINE PITCH PATCH ARCHITECTURE AND METHOD OF MAKING
- Publication number 20230260914
- Publication date Aug 17, 2023
- Intel Corporation
- Sanka GANESAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRATHIN BRIDGE AND MULTI-DIE ULTRAFINE PITCH PATCH ARCHITECTURE A...
- Publication number 20210043570
- Publication date Feb 11, 2021
- Intel Corporation
- Sanka GANESAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-DIE ULTRAFINE PITCH PATCH ARCHITECTURE AND METHOD OF MAKING
- Publication number 20210035911
- Publication date Feb 4, 2021
- Intel Corporation
- Sanka GANESAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONSTRAINED CURE COMPONENT ATTACH PROCESS FOR IMPROVED IC PACKAGE W...
- Publication number 20190103345
- Publication date Apr 4, 2019
- Intel Corporation
- Kyle YAZZIE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR