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Leigh M. TRIBOLET
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Chandler, AZ, US
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Patents Grants
last 30 patents
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Patent Grant
Ultrathin bridge and multi-die ultrafine pitch patch architecture a...
Patent number
11,756,889
Issue date
Sep 12, 2023
Intel Corporation
Sanka Ganesan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multi-die ultrafine pitch patch architecture and method of making
Patent number
11,694,959
Issue date
Jul 4, 2023
Intel Corporation
Sanka Ganesan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Constrained cure component attach process for improved IC package w...
Patent number
10,290,569
Issue date
May 14, 2019
Intel Corporation
Kyle Yazzie
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
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Patent Application
MULTI-DIE ULTRAFINE PITCH PATCH ARCHITECTURE AND METHOD OF MAKING
Publication number
20230260914
Publication date
Aug 17, 2023
Intel Corporation
Sanka GANESAN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ULTRATHIN BRIDGE AND MULTI-DIE ULTRAFINE PITCH PATCH ARCHITECTURE A...
Publication number
20210043570
Publication date
Feb 11, 2021
Intel Corporation
Sanka GANESAN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTI-DIE ULTRAFINE PITCH PATCH ARCHITECTURE AND METHOD OF MAKING
Publication number
20210035911
Publication date
Feb 4, 2021
Intel Corporation
Sanka GANESAN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CONSTRAINED CURE COMPONENT ATTACH PROCESS FOR IMPROVED IC PACKAGE W...
Publication number
20190103345
Publication date
Apr 4, 2019
Intel Corporation
Kyle YAZZIE
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR