Lejun HU

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Somerville, MA, US

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Patents Grantslast 30 patents

Information Patent Grant
On-chip temperature sensor using interconnect metal
- Patent number 9,200,968
- Issue date Dec 1, 2015
- Analog Devices, Inc.
- Michael Coln
- G01 - MEASURING TESTING
Information Patent Grant
Electrical overstress protection using through-silicon-via (TSV)
- Patent number 8,525,299
- Issue date Sep 3, 2013
- Analog Devices, Inc.
- Lejun Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical overstress protection using through-silicon-via (TSV)
- Patent number 8,441,104
- Issue date May 14, 2013
- Analog Devices, Inc.
- Lejun Hu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRICAL OVERSTRESS PROTECTION USING THROUGH-SILICON-VIA (TSV)
- Publication number 20130175669
- Publication date Jul 11, 2013
- Analog Devices, Inc.
- Lejun HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL OVERSTRESS PROTECTION USING THROUGH-SILICON-VIA (TSV)
- Publication number 20130119502
- Publication date May 16, 2013
- Analog Devices, Inc.
- Lejun HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ON-CHIP TEMPERATURE SENSOR USING INTERCONNECT METAL
- Publication number 20130070805
- Publication date Mar 21, 2013
- Analog Devices, Inc.
- Michael COLN
- G01 - MEASURING TESTING