Leming Wang

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Monrovia, CA, US

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Patents Applicationslast 30 patents

Information Patent Application
INTERNALLY COOLED, THERMALLY CLOSED MODULAR LASER PACKAGE SYSTEM
- Publication number 20130051413
- Publication date Feb 28, 2013
- AGX Technologies, Inc.
- Pei Chuang Chen
- H01 - BASIC ELECTRIC ELEMENTS