Len-Yi Leu

Person

Hsinchu, TW

People

Patents Grantslast 30 patents

Information Patent Grant
MEMS devices and methods of forming the same
- Patent number 10,981,779
- Issue date Apr 20, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Fung Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for forming micro-electro-mechanical system (MEMS) structure
- Patent number 10,865,100
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kai-Fung Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micro-electro-mechanical system (MEMS) structure including isolatio...
- Patent number 10,343,895
- Issue date Jul 9, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kai-Fung Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS device with multi pressure
- Patent number 10,266,400
- Issue date Apr 23, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Fung Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device
- Patent number 10,112,822
- Issue date Oct 30, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kai-Fung Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS devices and methods of forming the same
- Patent number 9,926,190
- Issue date Mar 27, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Fung Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 9,868,630
- Issue date Jan 16, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kai-Fung Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS cap with multi pressure
- Patent number 9,764,948
- Issue date Sep 19, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Fung Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS device with a bonding layer embedded in the cap
- Patent number 9,540,231
- Issue date Jan 10, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kai-Fung Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Split gate flash memory cell structure and method of manufacturing...
- Patent number 6,924,527
- Issue date Aug 2, 2005
- Winbond Electronics Corporation
- Ching-Hsiang Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor plate formation in a mixed analog-nonvolatile memory device
- Patent number 6,395,590
- Issue date May 28, 2002
- Winbond Electronics Corporation
- Len-Yi Leu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for making flash memory cell having reentrant angle floating...
- Patent number 6,365,459
- Issue date Apr 2, 2002
- Winbond Electronics Corp.
- Len-Yi Leu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Split gate flash memory cell with self-aligned process
- Patent number 6,174,771
- Issue date Jan 16, 2001
- Winbond Electronics Corp.
- Len-Yi Leu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor with oxide/nitride/oxide composite dielectric suitable fo...
- Patent number 6,015,984
- Issue date Jan 18, 2000
- Winbond Electronics Corp.
- Len-Yi Leu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR FORMING MICRO-ELECTRO-MECHANICAL SYSTEM (MEMS) STRUCTURE
- Publication number 20190315620
- Publication date Oct 17, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kai-Fung CHANG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICRO-ELECTRO-MECHANICAL SYSTEM (MEMS) STRUCTURE AND METHOD FOR FOR...
- Publication number 20190002275
- Publication date Jan 3, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kai-Fung CHANG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20180230001
- Publication date Aug 16, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kai-Fung CHANG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS Devices and Methods of Forming the Same
- Publication number 20180194618
- Publication date Jul 12, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Fung Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS Device with Multi Pressure
- Publication number 20180002166
- Publication date Jan 4, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Fung Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20170334711
- Publication date Nov 23, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kai-Fung CHANG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS Devices and Methods of Forming the Same
- Publication number 20170210618
- Publication date Jul 27, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Fung Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS Cap with Multi Pressure
- Publication number 20170210619
- Publication date Jul 27, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Fung Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROELECTROMECHANICAL SYSTEMS (MEMS) STOPPER STRUCTURE FOR STICTIO...
- Publication number 20160167945
- Publication date Jun 16, 2016
- Taiwan Semiconductor Manufacturing Co., LTD
- Kai-Fung CHANG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME
- Publication number 20150210537
- Publication date Jul 30, 2015
- Taiwan Semiconductor Manufacturing Co., LTD
- Kai-Fung CHANG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Split gate flash memory cell structure and method of manufacturing...
- Publication number 20030047766
- Publication date Mar 13, 2003
- Winbond Electronics Corporation
- Ching-Hsiang Hsu
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

MEMS devices and methods of forming the same

Method for forming micro-electro-mechanical system (MEMS) structure

Micro-electro-mechanical system (MEMS) structure including isolatio...

MEMS device with multi pressure

Semiconductor device

MEMS devices and methods of forming the same

Package structure and manufacturing method thereof

MEMS cap with multi pressure

MEMS device with a bonding layer embedded in the cap

Split gate flash memory cell structure and method of manufacturing...

Capacitor plate formation in a mixed analog-nonvolatile memory device

Method for making flash memory cell having reentrant angle floating...

Split gate flash memory cell with self-aligned process

Capacitor with oxide/nitride/oxide composite dielectric suitable fo...

Patents Applicationslast 30 patents

METHOD FOR FORMING MICRO-ELECTRO-MECHANICAL SYSTEM (MEMS) STRUCTURE

MICRO-ELECTRO-MECHANICAL SYSTEM (MEMS) STRUCTURE AND METHOD FOR FOR...

SEMICONDUCTOR DEVICE

MEMS Devices and Methods of Forming the Same

MEMS Device with Multi Pressure

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

MEMS Devices and Methods of Forming the Same

MEMS Cap with Multi Pressure

MICROELECTROMECHANICAL SYSTEMS (MEMS) STOPPER STRUCTURE FOR STICTIO...

SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME

Split gate flash memory cell structure and method of manufacturing...