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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package with thermal fins
- Patent number 10,573,575
- Issue date Feb 25, 2020
- Intel Corporation
- Hyoung Il Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assembly having second level interconnects includin...
- Patent number 7,750,466
- Issue date Jul 6, 2010
- Intel Corporation
- Timothy P. Rothman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for filling vias in organic, multi-layer packages
- Patent number 6,098,283
- Issue date Aug 8, 2000
- Intel Corporation
- Mike Goetsch
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DATA STORAGE SYSTEM USING WAFER-LEVEL PACKAGING
- Publication number 20190172820
- Publication date Jun 6, 2019
- Intel Corporation
- John G. MEYERS
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE WITH THERMAL FINS
- Publication number 20190067156
- Publication date Feb 28, 2019
- Intel Corporation
- Hyoung Il Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Microelectronic Assembly Having Second Level Interconnects Includin...
- Publication number 20090065943
- Publication date Mar 12, 2009
- Timothy P. Rothman
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...