Leo Li

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Hsinchu, TW

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Patents Applicationslast 30 patents

Information Patent Application
PACKAGE MODULE WITH A MODULE STIFFENER AND METHODS OF FORMING THE SAME
- Publication number 20240297087
- Publication date Sep 5, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Sheng-Kai CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-ON-WAFER-ON-BOARD STRUCTURE USING SPACER DIE AND METHODS OF FO...
- Publication number 20230420429
- Publication date Dec 28, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Sheng-Kai Chang
- H01 - BASIC ELECTRIC ELEMENTS