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Leo Liu
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Taipei, TW
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Patents Grants
last 30 patents
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Patent Grant
Socket with thermal conductor
Patent number
11,259,399
Issue date
Feb 22, 2022
Intel Corporation
Hongfei Yan
G01 - MEASURING TESTING
Patents Applications
last 30 patents
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Patent Application
SOCKET WITH THERMAL CONDUCTOR
Publication number
20190045619
Publication date
Feb 7, 2019
Intel Corporation
Hongfei Yan
H01 - BASIC ELECTRIC ELEMENTS