Leo M. Higgins III

Person

Austin, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Packaged integrated circuit having stacked die and method for therefor
- Patent number 10,446,476
- Issue date Oct 15, 2019
- NXP USA, INC.
- Leo M. Higgins
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Variable stealth laser dicing process
- Patent number 10,347,534
- Issue date Jul 9, 2019
- NXP B.V.
- Martin Lapke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface finish for wirebonding
- Patent number 10,325,876
- Issue date Jun 18, 2019
- NXP USA, INC.
- Varughese Mathew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged integrated circuit device and methods
- Patent number 10,249,557
- Issue date Apr 2, 2019
- NXP USA, INC.
- Leo M. Higgins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor device and method for forming
- Patent number 10,242,935
- Issue date Mar 26, 2019
- NXP USA, INC.
- Burton Jesse Carpenter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a protective material with a first pH f...
- Patent number 10,037,965
- Issue date Jul 31, 2018
- NXP USA, INC.
- Leo M. Higgins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser sintered interconnections between die
- Patent number 9,935,079
- Issue date Apr 3, 2018
- NXP USA, INC.
- Chee Seng Foong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for manufacturing a packaged device with an extended struct...
- Patent number 9,899,290
- Issue date Feb 20, 2018
- NXP USA, INC.
- Leo M. Higgins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bond mold lock method and structure
- Patent number 9,685,351
- Issue date Jun 20, 2017
- NXP USA, INC.
- Leo M. Higgins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for protecting copper wire bonds on aluminum pads of a semic...
- Patent number 9,508,622
- Issue date Nov 29, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Leo M. Higgins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensing field effect transistor devices and method of their manufac...
- Patent number 9,470,652
- Issue date Oct 18, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Stephen R. Hooper
- G01 - MEASURING TESTING
Information Patent Grant
Method and apparatus for assembling a semiconductor package
- Patent number 9,461,009
- Issue date Oct 4, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Leo M. Higgins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper ball bond features and structure
- Patent number 9,461,012
- Issue date Oct 4, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Leo M. Higgins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices with compliant interconnects
- Patent number 9,324,667
- Issue date Apr 26, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Trent S. Uehling
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor device
- Patent number 9,287,200
- Issue date Mar 15, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Leo M. Higgins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally enhanced package with lid heat spreader
- Patent number 9,269,648
- Issue date Feb 23, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Leo M. Higgins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for plating a semiconductor package lead
- Patent number 9,224,651
- Issue date Dec 29, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Leo M. Higgins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die-to-die inductive communication devices and methods
- Patent number 9,219,028
- Issue date Dec 22, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Leo M. Higgins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,111,952
- Issue date Aug 18, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Leo M. Higgins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a semiconductor device assembly having a heat sp...
- Patent number 9,111,878
- Issue date Aug 18, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Leo M. Higgins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encapsulant for a semiconductor device
- Patent number 9,093,383
- Issue date Jul 28, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Sheila F. Chopin
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Method for forming die assembly with heat spreader
- Patent number 9,059,144
- Issue date Jun 16, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Leo M. Higgins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for treating a bond pad of a package substrate
- Patent number 9,012,263
- Issue date Apr 21, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Varughese Mathew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and structures for reducing stress on die assembly
- Patent number 8,970,026
- Issue date Mar 3, 2015
- FREESCALE SEMICONDUCTOR, INC.
- George R. Leal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mold compound compatibility test system and methods thereof
- Patent number 8,955,388
- Issue date Feb 17, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Varughese Mathew
- G01 - MEASURING TESTING
Information Patent Grant
Packaging for semiconductor sensor devices and methods
- Patent number 8,946,833
- Issue date Feb 3, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Leo M. Higgins
- G01 - MEASURING TESTING
Information Patent Grant
Thermally enhanced package with lid heat spreader
- Patent number 8,921,994
- Issue date Dec 30, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Leo M. Higgins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper ball bond features and structure
- Patent number 8,907,485
- Issue date Dec 9, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Leo M. Higgins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encapsulant for a semiconductor device
- Patent number 8,853,867
- Issue date Oct 7, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Sheila F. Chopin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assembly having a heat spreader
- Patent number 8,754,521
- Issue date Jun 17, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Burton J. Carpenter
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGED INTEGRATED CIRCUIT HAVING STACKED DIE AND METHOD FOR THEREFOR
- Publication number 20190088576
- Publication date Mar 21, 2019
- NXP USA, Inc.
- LEO M. HIGGINS
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
VARIABLE STEALTH LASER DICING PROCESS
- Publication number 20190080963
- Publication date Mar 14, 2019
- NXP B.V.
- Martin LAPKE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED SEMICONDUCTOR DEVICE AND METHOD FOR FORMING
- Publication number 20190067172
- Publication date Feb 28, 2019
- NXP USA, Inc.
- Burton Jesse CARPENTER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED INTEGRATED CIRCUIT DEVICE AND METHODS
- Publication number 20180342444
- Publication date Nov 29, 2018
- NXP USA, Inc.
- Leo M. HIGGINS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaged device with extended structure for forming an opening in t...
- Publication number 20170278768
- Publication date Sep 28, 2017
- FREESCALE SEMICONDUCTOR, INC.
- LEO M. HIGGINS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH PROTECTIVE MATERIAL AND METHOD FOR ENCAPS...
- Publication number 20170040282
- Publication date Feb 9, 2017
- FREESCALE SEMICONDUCTOR, INC.
- LEO M. HIGGINS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wire Bond Mold Lock Method and Structure
- Publication number 20160020182
- Publication date Jan 21, 2016
- FREESCALE SEMICONDUCTOR, INC.
- LEO M. HIGGINS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SURFACE FINISH FOR WIREBONDING
- Publication number 20150380376
- Publication date Dec 31, 2015
- VARUGHESE MATHEW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermally Enhanced Package with Lid Heat Spreader
- Publication number 20150145114
- Publication date May 28, 2015
- FREESCALE SEMICONDUCTOR, INC.
- LEO M. HIGGINS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR TREATING A BOND PAD OF A PACKAGE SUBSTRATE
- Publication number 20150118791
- Publication date Apr 30, 2015
- Varughese Mathew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Copper Ball Bond Features and Structure
- Publication number 20150084199
- Publication date Mar 26, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Leo M. Higgins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED SEMICONDUCTOR DEVICE
- Publication number 20150001691
- Publication date Jan 1, 2015
- LEO M. HIGGINS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TIN-BASED WIREBOND STRUCTURES
- Publication number 20140367859
- Publication date Dec 18, 2014
- Burton J. Carpenter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PLATING A SEMICONDUCTOR PACKAGE LEAD
- Publication number 20140287554
- Publication date Sep 25, 2014
- FREESCALE SEMICONDUCTOR, INC.
- LEO M. HIGGINS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20140273352
- Publication date Sep 18, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Leo M. Higgins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND STRUCTURES FOR REDUCING STRESS ON DIE ASSEMBLY
- Publication number 20140225268
- Publication date Aug 14, 2014
- GEORGE R. LEAL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENCAPSULANT FOR A SEMICONDUCTOR DEVICE
- Publication number 20140145339
- Publication date May 29, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Sheila F. CHOPIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING FOR SEMICONDUCTOR SENSOR DEVICES AND METHODS
- Publication number 20140110801
- Publication date Apr 24, 2014
- Leo M. Higgins
- G01 - MEASURING TESTING
Information Patent Application
Thermally Enhanced Package with Lid Heat Spreader
- Publication number 20140077349
- Publication date Mar 20, 2014
- LEO M. HIGGINS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Copper Ball Bond Features and Structure
- Publication number 20140054781
- Publication date Feb 27, 2014
- Leo M. Higgins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PLATING A SEMICONDUCTOR PACKAGE LEAD
- Publication number 20140038356
- Publication date Feb 6, 2014
- LEO M. HIGGINS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLD COMPOUND COMPATIBILITY TEST SYSTEM AND METHODS THEREOF
- Publication number 20130319129
- Publication date Dec 5, 2013
- FREESCALE SEMICONDUCTOR, INC.
- Varughese Mathew
- G01 - MEASURING TESTING
Information Patent Application
INTEGRATED CIRCUIT DIE ASSEMBLY WITH HEAT SPREADER
- Publication number 20130320548
- Publication date Dec 5, 2013
- BURTON J. CARPENTER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING DIE ASSEMBLY WITH HEAT SPREADER
- Publication number 20130221511
- Publication date Aug 29, 2013
- Leo M. Higgins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES WITH COMPLIANT INTERCONNECTS
- Publication number 20130181340
- Publication date Jul 18, 2013
- Trent S. UEHLING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH A HEAT SPREADER AND METHOD OF MAKING
- Publication number 20130037931
- Publication date Feb 14, 2013
- LEO M. HIGGINS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thin array plastic package without die attach pad and process for f...
- Publication number 20060154403
- Publication date Jul 13, 2006
- Neil McLellan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and structure for ex-situ polymer stud grid array contact fo...
- Publication number 20020140096
- Publication date Oct 3, 2002
- Siemens Dematic Electronics Assembly Systems, Inc.
- Leo M. Higgins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High strength vias
- Publication number 20020140105
- Publication date Oct 3, 2002
- Leo M. Higgins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and system for automated dynamic fiber optic alignment and a...
- Publication number 20020131729
- Publication date Sep 19, 2002
- Leo M. Higgins
- G02 - OPTICS

Leo M. Higgins III

Person

Patents Grantslast 30 patents

Packaged integrated circuit having stacked die and method for therefor

Variable stealth laser dicing process

Surface finish for wirebonding

Packaged integrated circuit device and methods

Packaged semiconductor device and method for forming

Semiconductor device having a protective material with a first pH f...

Laser sintered interconnections between die

Methods for manufacturing a packaged device with an extended struct...

Wire bond mold lock method and structure

Method for protecting copper wire bonds on aluminum pads of a semic...

Sensing field effect transistor devices and method of their manufac...

Method and apparatus for assembling a semiconductor package

Copper ball bond features and structure

Semiconductor devices with compliant interconnects

Packaged semiconductor device

Thermally enhanced package with lid heat spreader

Method for plating a semiconductor package lead

Die-to-die inductive communication devices and methods

Semiconductor device

Method for forming a semiconductor device assembly having a heat sp...

Encapsulant for a semiconductor device

Method for forming die assembly with heat spreader

Method for treating a bond pad of a package substrate

Methods and structures for reducing stress on die assembly

Mold compound compatibility test system and methods thereof

Packaging for semiconductor sensor devices and methods

Thermally enhanced package with lid heat spreader

Copper ball bond features and structure

Encapsulant for a semiconductor device

Semiconductor device assembly having a heat spreader

Patents Applicationslast 30 patents

PACKAGED INTEGRATED CIRCUIT HAVING STACKED DIE AND METHOD FOR THEREFOR

VARIABLE STEALTH LASER DICING PROCESS

PACKAGED SEMICONDUCTOR DEVICE AND METHOD FOR FORMING

PACKAGED INTEGRATED CIRCUIT DEVICE AND METHODS

Packaged device with extended structure for forming an opening in t...

SEMICONDUCTOR DEVICE WITH PROTECTIVE MATERIAL AND METHOD FOR ENCAPS...

Wire Bond Mold Lock Method and Structure

SURFACE FINISH FOR WIREBONDING

Thermally Enhanced Package with Lid Heat Spreader

METHOD FOR TREATING A BOND PAD OF A PACKAGE SUBSTRATE

Copper Ball Bond Features and Structure

PACKAGED SEMICONDUCTOR DEVICE

TIN-BASED WIREBOND STRUCTURES

METHOD FOR PLATING A SEMICONDUCTOR PACKAGE LEAD

SEMICONDUCTOR DEVICE

METHODS AND STRUCTURES FOR REDUCING STRESS ON DIE ASSEMBLY

ENCAPSULANT FOR A SEMICONDUCTOR DEVICE

PACKAGING FOR SEMICONDUCTOR SENSOR DEVICES AND METHODS

Thermally Enhanced Package with Lid Heat Spreader

Copper Ball Bond Features and Structure

METHOD FOR PLATING A SEMICONDUCTOR PACKAGE LEAD

MOLD COMPOUND COMPATIBILITY TEST SYSTEM AND METHODS THEREOF

INTEGRATED CIRCUIT DIE ASSEMBLY WITH HEAT SPREADER

METHOD FOR FORMING DIE ASSEMBLY WITH HEAT SPREADER

SEMICONDUCTOR DEVICES WITH COMPLIANT INTERCONNECTS

SEMICONDUCTOR PACKAGE WITH A HEAT SPREADER AND METHOD OF MAKING

Thin array plastic package without die attach pad and process for f...

Method and structure for ex-situ polymer stud grid array contact fo...

High strength vias

Method and system for automated dynamic fiber optic alignment and a...