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Leon Ashley
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Danbury, CT, US
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last 30 patents
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Patent Grant
Copper interconnections with enhanced electromigration resistance a...
Patent number
6,348,731
Issue date
Feb 19, 2002
International Business Machines Corporation
Leon Ashley
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of forming copper interconnections with enhanced electromigr...
Patent number
6,287,954
Issue date
Sep 11, 2001
International Business Machines Corporation
Leon Ashley
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of forming copper interconnections with enhanced electromigr...
Patent number
6,130,161
Issue date
Oct 10, 2000
International Business Machines Corporation
Leon Ashley
H01 - BASIC ELECTRIC ELEMENTS