Leon KHILCHENKO

Person

Manchester, NH, US

People

Patents Grantslast 30 patents

Information Patent Grant
Electrical connector having thick film layers
- Patent number 11,336,060
- Issue date May 17, 2022
- Amphenol Corporation
- Leon Khilchenko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical connector having a film layer
- Patent number 10,186,814
- Issue date Jan 22, 2019
- Amphenol Corporation
- Leon Khilchenko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical connector having thick film layers
- Patent number 8,382,524
- Issue date Feb 26, 2013
- Amphenol Corporation
- Leon Khilchenko
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Printed circuit board minimizing undesirable signal reflections in...
- Patent number 8,115,110
- Issue date Feb 14, 2012
- Amphenol Corporation
- Leon M. Khilchenko
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lead(Pb)-free electronic component attachment
- Patent number 7,630,210
- Issue date Dec 8, 2009
- Amphenol Corporation
- Mark W. Gailus
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board for high speed, high density electrical conne...
- Patent number 7,508,681
- Issue date Mar 24, 2009
- Amphenol Corporation
- Jason J. Payne
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component with high density, low cost attachment
- Patent number 7,484,971
- Issue date Feb 3, 2009
- Amphenol Corporation
- Mark W. Gailus
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board for high speed, high density electrical conne...
- Patent number 7,242,592
- Issue date Jul 10, 2007
- Amphenol Corporation
- Jason J. Payne
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making an electrical connection to a conductor on an inne...
- Patent number 7,240,425
- Issue date Jul 10, 2007
- Amphenol Corporation
- Leon M. Khilchenko
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
ELECTRICAL CONNECTOR HAVING THICK FILM LAYERS
- Publication number 20190157814
- Publication date May 23, 2019
- Amphenol Corporation
- Leon KHILCHENKO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL CONNECTOR HAVING THICK FILM LAYERS
- Publication number 20130225006
- Publication date Aug 29, 2013
- Amphenol Corporation
- Leon KHILCHENKO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL CONNECTOR HAVING THICK FILM LAYERS
- Publication number 20120094536
- Publication date Apr 19, 2012
- Leon KHILCHENKO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Printed circuit board for high speed, high density electrical conne...
- Publication number 20080030970
- Publication date Feb 7, 2008
- Jason J. Payne
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed circuit board minimizing undesirable signal reflections in...
- Publication number 20070258223
- Publication date Nov 8, 2007
- Amphenol Corporation
- Leon M. Khilchenko
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic component with high density, low cost attachment
- Publication number 20070207635
- Publication date Sep 6, 2007
- Mark W. Gailus
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Lead(Pb)-free electronic component attachment
- Publication number 20070205497
- Publication date Sep 6, 2007
- Mark W. Gailus
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed circuit board for high speed, high density electrical conne...
- Publication number 20040264153
- Publication date Dec 30, 2004
- Jason J. Payne
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed circuit board minimizing undesirable signal reflections in...
- Publication number 20040212972
- Publication date Oct 28, 2004
- Leon M. Khilchenko
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Leon KHILCHENKO

Person

Patents Grantslast 30 patents

Electrical connector having thick film layers

Electrical connector having a film layer

Electrical connector having thick film layers

Printed circuit board minimizing undesirable signal reflections in...

Lead(Pb)-free electronic component attachment

Printed circuit board for high speed, high density electrical conne...

Electronic component with high density, low cost attachment

Printed circuit board for high speed, high density electrical conne...

Method of making an electrical connection to a conductor on an inne...

Patents Applicationslast 30 patents

ELECTRICAL CONNECTOR HAVING THICK FILM LAYERS

ELECTRICAL CONNECTOR HAVING THICK FILM LAYERS

ELECTRICAL CONNECTOR HAVING THICK FILM LAYERS

Printed circuit board for high speed, high density electrical conne...

Printed circuit board minimizing undesirable signal reflections in...

Electronic component with high density, low cost attachment

Lead(Pb)-free electronic component attachment

Printed circuit board for high speed, high density electrical conne...

Printed circuit board minimizing undesirable signal reflections in...