TREA

Leon R. Barstad

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  • Raynham, MA, US
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Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    METHOD OF FILLING THROUGH-HOLES TO REDUCE VOIDS AND OTHER DEFECTS
    • Publication number 20170238427
    • Publication date Aug 17, 2017
    • Rohm and Haas Electronic Materials L.L.C.
    • Nagarajan Jayaraju
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    METHOD OF FILLING THROUGH-HOLES TO REDUCE VOIDS AND OTHER DEFECTS
    • Publication number 20170233886
    • Publication date Aug 17, 2017
    • Rohm and Haas Electronic Materials L.L.C.
    • Nagarajan Jayaraju
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    FILLING THROUGH-HOLES
    • Publication number 20160105975
    • Publication date Apr 14, 2016
    • Rohm and Haas Electronic Materials L.L.C.
    • Nagarajan JAYARAJU
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    METHOD OF FILLING THROUGH-HOLES
    • Publication number 20140262801
    • Publication date Sep 18, 2014
    • Nagarajan JAYARAJU
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    METHOD OF FILLING THROUGH-HOLES
    • Publication number 20140262799
    • Publication date Sep 18, 2014
    • Rohm and Haas Electronic Materials L.L.C.
    • Nagarajan JAYARAJU
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    METHOD OF ELECTROPLATING UNIFORM COPPER LAYERS
    • Publication number 20120318676
    • Publication date Dec 20, 2012
    • Rohm and Haas Electronic Materials L.L.C.
    • Elie H. NAJJAR
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    Electrolytic copper plating solutions
    • Publication number 20060183328
    • Publication date Aug 17, 2006
    • Leon R. Barstad
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    Analysis method
    • Publication number 20060151327
    • Publication date Jul 13, 2006
    • Rohm and Haas Electronic Materials, L.L.C.
    • Wade Sonnenberg
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    Reverse pulse plating composition and method
    • Publication number 20060081475
    • Publication date Apr 20, 2006
    • Shipley Company, L.L.C.
    • Leon R. Barstad
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    Electrolytic copper plating solutions
    • Publication number 20060065537
    • Publication date Mar 30, 2006
    • Leon R. Barstad
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    Plating bath and method for depositing a metal layer on a substrate
    • Publication number 20050155866
    • Publication date Jul 21, 2005
    • Shipley Company, L.L.C.
    • David R. Gabe
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    Plating bath and method for depositing a metal layer on a substrate
    • Publication number 20050139118
    • Publication date Jun 30, 2005
    • Shipley Company, L.L.C.
    • Andrew J. Cobley
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    Reverse pulse plating composition and method
    • Publication number 20050016858
    • Publication date Jan 27, 2005
    • Shipley Company, L.L.C.
    • Leon R. Barstad
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    Bath analysis
    • Publication number 20050016856
    • Publication date Jan 27, 2005
    • Rohm and Haas Electronic Materials, L.L.C.
    • Wade Sonnenberg
    • G01 - MEASURING TESTING
  • Information Patent Application

    Plating bath and method for depositing a metal layer on a substrate
    • Publication number 20040206631
    • Publication date Oct 21, 2004
    • Shipley Company, L.L.C.
    • Andrew J. Cobley
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    Plating bath and method for depositing a metal layer on a substrate
    • Publication number 20040104124
    • Publication date Jun 3, 2004
    • Shipley Company, L.L.C.
    • Andrew J. Cobley
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    Plating bath and method for depositing a metal layer on a substrate
    • Publication number 20040074778
    • Publication date Apr 22, 2004
    • Shipley Company, L.L.C.
    • Andrew J. Cobley
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    Plating bath and method for depositing a metal layer on a substrate
    • Publication number 20030102226
    • Publication date Jun 5, 2003
    • Shipley Company, L.L.C.
    • David R. Gabe
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    Plating bath and method for depositing a metal layer on a substrate
    • Publication number 20030085132
    • Publication date May 8, 2003
    • Shipley Company, L.L.C.
    • Andrew J. Cobley
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    Plating bath and method for depositing a metal layer on a substrate
    • Publication number 20030070934
    • Publication date Apr 17, 2003
    • Shipley Company, L.L.C.
    • Andrew J. Cobley
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    Plating bath and method for depositing a metal layer on a substrate
    • Publication number 20030066756
    • Publication date Apr 10, 2003
    • Shipley Company, L.L.C.
    • David R. Gabe
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    Electrolytic copper plating solutions
    • Publication number 20030010646
    • Publication date Jan 16, 2003
    • Leon R. Barstad
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    Plating bath analysis
    • Publication number 20020074244
    • Publication date Jun 20, 2002
    • Shipley Company, L.L.C.
    • Wade Sonnenberg
    • G01 - MEASURING TESTING
  • Information Patent Application

    Seed layer repair method
    • Publication number 20020000382
    • Publication date Jan 3, 2002
    • Shipley Company, L.L.C. of Marlborough
    • Denis Morrissey
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    ELECTROLYTIC COPPER PLATING SOLUTIONS
    • Publication number 20010047943
    • Publication date Dec 6, 2001
    • LEON BARSTAD
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR