Leon Stiborek

Person

Dallas, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Molded packaged antenna
- Patent number 11,271,296
- Issue date Mar 8, 2022
- Texas Instruments Incorporated
- Leon Stiborek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for dicing and singulating substrates
- Patent number 7,244,664
- Issue date Jul 17, 2007
- Texas Instruments Incorporated
- David B. Blair
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Restrained center core anisotropically conductive adhesive
- Patent number 6,052,286
- Issue date Apr 18, 2000
- Texas Instruments Incorporated
- Karl L. Worthen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming screen printed or mask printed microwave absorbin...
- Patent number 5,397,854
- Issue date Mar 14, 1995
- Texas Instruments Incorporated
- Martin L. Catt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Screen printed of mask printed microwave absorbing material on modu...
- Patent number 5,324,887
- Issue date Jun 28, 1994
- Texas Instruments Incorporated
- Martin L. Catt
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MOLDED PACKAGED ANTENNA
- Publication number 20190148823
- Publication date May 16, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Leon STIBOREK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRESS AND COLLAPSE RESISTANT INTERCONNECT FOR MOUNTING AN INTEGRAT...
- Publication number 20080158842
- Publication date Jul 3, 2008
- TEXAS INSTRUMENTS INCORPORATED
- Leon Stiborek
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
UNDERFILL DISPENSE AT SUBSTRATE APERTURE
- Publication number 20080085573
- Publication date Apr 10, 2008
- TEXAS INSTRUMENTS INCORPORATED
- Charles Anthony Odegard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Underfill dispense at substrate aperture
- Publication number 20060234427
- Publication date Oct 19, 2006
- Charles Anthony Odegard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for dicing and singulating substrates
- Publication number 20050095816
- Publication date May 5, 2005
- TEXAS INSTRUMENTS INCORPORATED
- David B. Blair
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated circuit package with spacer
- Publication number 20040037059
- Publication date Feb 26, 2004
- Leon Stiborek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Particle-filled semiconductor attachment material
- Publication number 20040007780
- Publication date Jan 15, 2004
- Paul Joseph Hundt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dicing saw having an annularly supported dicing blade
- Publication number 20030136394
- Publication date Jul 24, 2003
- TEXAS INSTRUMENTS INCORPORATED
- David B. Blair
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Leon Stiborek

Person

Patents Grantslast 30 patents

Molded packaged antenna

Method for dicing and singulating substrates

Restrained center core anisotropically conductive adhesive

Method of forming screen printed or mask printed microwave absorbin...

Screen printed of mask printed microwave absorbing material on modu...

Patents Applicationslast 30 patents

MOLDED PACKAGED ANTENNA

STRESS AND COLLAPSE RESISTANT INTERCONNECT FOR MOUNTING AN INTEGRAT...

UNDERFILL DISPENSE AT SUBSTRATE APERTURE

Underfill dispense at substrate aperture

Method for dicing and singulating substrates

Integrated circuit package with spacer

Particle-filled semiconductor attachment material

Dicing saw having an annularly supported dicing blade