Leonard J. Gardecki

Person

Essex, VT, US

People

Patents Grantslast 30 patents

Information Patent Grant
Mask and substrate alignment for solder bump process
- Patent number 7,670,437
- Issue date Mar 2, 2010
- International Business Machines Corporation
- Duane E Allen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mask and substrate alignment for solder bump process
- Patent number 7,410,919
- Issue date Aug 12, 2008
- International Business Machines Corporation
- Duane E Allen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming interconnects on thin wafers
- Patent number 7,288,492
- Issue date Oct 30, 2007
- International Business Machines Corporation
- Leonard J. Gardecki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer integrated rigid support ring
- Patent number 7,138,326
- Issue date Nov 21, 2006
- International Business Machines Corp.
- Harry D. Cox
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming interconnects on thin wafers
- Patent number 6,951,775
- Issue date Oct 4, 2005
- International Business Machines Corporation
- Leonard J. Gardecki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer integrated rigid support ring
- Patent number 6,706,621
- Issue date Mar 16, 2004
- International Business Machines Corporation
- Harry D. Cox
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for removing surface irregularities from a flat workpiece
- Patent number 5,895,312
- Issue date Apr 20, 1999
- International Business Machines Corporation
- Dennis Albert Covert
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
MASK AND SUBSTRATE ALIGNMENT FOR SOLDER BUMP PROCESS
- Publication number 20080202421
- Publication date Aug 28, 2008
- Duane E. Allen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING INTERCONNECTS ON THIN WAFERS
- Publication number 20070278729
- Publication date Dec 6, 2007
- Leonard J. Gardecki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wafer integrated rigid support ring
- Publication number 20070045830
- Publication date Mar 1, 2007
- International Business Machines Corporation
- Harry D. Cox
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for forming interconnects on thin wafers
- Publication number 20050272241
- Publication date Dec 8, 2005
- Leonard J. Gardecki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR FORMING INTERCONNECTS ON THIN WAFERS
- Publication number 20040266159
- Publication date Dec 30, 2004
- International Business Machines Corporation
- Leonard J Gardecki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MASK AND SUBSTRATE ALIGNMENT FOR SOLDER BUMP PROCESS
- Publication number 20040261977
- Publication date Dec 30, 2004
- International Business Machines Corporation
- Duane E. Allen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer integrated rigid support ring
- Publication number 20040135233
- Publication date Jul 15, 2004
- Harry D. Cox
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer integrated rigid support ring
- Publication number 20030071329
- Publication date Apr 17, 2003
- International Business Machines Corporation
- Harry D. Cox
- H01 - BASIC ELECTRIC ELEMENTS

Leonard J. Gardecki

Person

Patents Grantslast 30 patents

Mask and substrate alignment for solder bump process

Mask and substrate alignment for solder bump process

Method for forming interconnects on thin wafers

Wafer integrated rigid support ring

Method for forming interconnects on thin wafers

Wafer integrated rigid support ring

Apparatus for removing surface irregularities from a flat workpiece

Patents Applicationslast 30 patents

MASK AND SUBSTRATE ALIGNMENT FOR SOLDER BUMP PROCESS

METHOD FOR FORMING INTERCONNECTS ON THIN WAFERS

Wafer integrated rigid support ring

Method for forming interconnects on thin wafers

METHOD FOR FORMING INTERCONNECTS ON THIN WAFERS

MASK AND SUBSTRATE ALIGNMENT FOR SOLDER BUMP PROCESS

Wafer integrated rigid support ring

Wafer integrated rigid support ring