Leonard M. Neiberg

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Hillsboro, OR, US

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Patents Grantslast 30 patents

Information Patent Grant
Die interconnection scheme for providing a high yielding process fo...
- Patent number 11,652,060
- Issue date May 16, 2023
- Intel Corporation
- Wilfred Gomes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Functionally redundant semiconductor dies and package
- Patent number 11,127,712
- Issue date Sep 21, 2021
- Intel Corporation
- Wilfred Gomes
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DIE INTERCONNECTION SCHEME FOR PROVIDING A HIGH YIELDING PROCESS FO...
- Publication number 20230245974
- Publication date Aug 3, 2023
- Intel Corporation
- Wilfred GOMES
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FUNCTIONALLY REDUNDANT SEMICONDUCTOR DIES AND PACKAGE
- Publication number 20210375825
- Publication date Dec 2, 2021
- Intel Corporation
- Wilfred Gomes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE INTERCONNECTION SCHEME FOR PROVIDING A HIGH YIELDING PROCESS FO...
- Publication number 20200211970
- Publication date Jul 2, 2020
- Intel Corporation
- Wilfred GOMES
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FUNCTIONALLY REDUNDANT SEMICONDUCTOR DIES AND PACKAGE
- Publication number 20190206834
- Publication date Jul 4, 2019
- Intel Corporation
- Wilfred Gomes
- H01 - BASIC ELECTRIC ELEMENTS