Leonard Richard Douglas

Person

Burnt Hills, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Waveguide including a plurality of waveguide segments
- Patent number 7,146,081
- Issue date Dec 5, 2006
- General Electric Company
- Ernest Wayne Balch
- G02 - OPTICS
Information Patent Grant
Method and apparatus for fabricating waveguides and waveguides fabr...
- Patent number 6,957,007
- Issue date Oct 18, 2005
- General Electric Company
- Ernest Wayne Balch
- G02 - OPTICS
Information Patent Grant
Apparatus for aligning die to interconnect metal on flex substrate
- Patent number 6,790,703
- Issue date Sep 14, 2004
- General Electric Company
- Richard Joseph Saia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High temperature circuit apparatus
- Patent number 6,603,145
- Issue date Aug 5, 2003
- General Electric Company
- Robert John Wojnarowski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method of collecting statistically analyzing and graphic...
- Patent number 6,574,522
- Issue date Jun 3, 2003
- General Electric Company
- Leonard Richard Douglas
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Method for aligning die to interconnect metal on flex substrate
- Patent number 6,475,877
- Issue date Nov 5, 2002
- General Electric Company
- Richard Joseph Saia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon carbide large area device fabrication apparatus and method
- Patent number 6,410,356
- Issue date Jun 25, 2002
- General Electric Company
- Robert John Wojnarowski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit chip package and fabrication method
- Patent number 6,396,153
- Issue date May 28, 2002
- General Electric Company
- Raymond Albert Fillion
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
HDI chip attachment method for reduced processing
- Patent number 6,284,564
- Issue date Sep 4, 2001
- Lockheed Martin Corp.
- Ernest Wayne Balch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit chip package and fabrication method
- Patent number 6,242,282
- Issue date Jun 5, 2001
- General Electric Company
- Raymond Albert Fillion
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a thin film inductor
- Patent number 6,040,226
- Issue date Mar 21, 2000
- General Electric Company
- Robert John Wojnarowski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a thin film capacitor
- Patent number 5,872,040
- Issue date Feb 16, 1999
- General Electric Company
- Robert John Wojnarowski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Scaled adaptive lithography
- Patent number 5,844,810
- Issue date Dec 1, 1998
- General Electric Company
- Leonard Richard Douglas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a thin film resistor
- Patent number 5,683,928
- Issue date Nov 4, 1997
- General Electric Company
- Robert John Wojnarowski
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method and apparatus for fabricating waveguides and waveguides fabr...
- Publication number 20060002676
- Publication date Jan 5, 2006
- Ernest Wayne Balch
- G02 - OPTICS
Information Patent Application
Method and apparatus for fabricating waveguides and waveguides fabr...
- Publication number 20040017974
- Publication date Jan 29, 2004
- General Electric Company
- Ernest Wayne Balch
- G02 - OPTICS
Information Patent Application
Computerized systems and methods for the creation and sharing of pr...
- Publication number 20030004763
- Publication date Jan 2, 2003
- Michael Robert LaBlanc
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Computerized systems and methods for acquiring and disseminating pr...
- Publication number 20030005057
- Publication date Jan 2, 2003
- Michael Robert LaBlanc
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Apparatus, method and product therefrom, for aligning die to interc...
- Publication number 20020197767
- Publication date Dec 26, 2002
- Richard Joseph Saia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Computerized systems and methods for performing new product introdu...
- Publication number 20020194044
- Publication date Dec 19, 2002
- Michael Robert Lablanc
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
High temperature circuit apparatus
- Publication number 20020121691
- Publication date Sep 5, 2002
- Robert John Wojnarowski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Circuit chip package and fabrication method
- Publication number 20010009779
- Publication date Jul 26, 2001
- Raymond Albert Fillion
- H01 - BASIC ELECTRIC ELEMENTS

Leonard Richard Douglas

Person

Patents Grantslast 30 patents

Waveguide including a plurality of waveguide segments

Method and apparatus for fabricating waveguides and waveguides fabr...

Apparatus for aligning die to interconnect metal on flex substrate

High temperature circuit apparatus

System and method of collecting statistically analyzing and graphic...

Method for aligning die to interconnect metal on flex substrate

Silicon carbide large area device fabrication apparatus and method

Circuit chip package and fabrication method

HDI chip attachment method for reduced processing

Circuit chip package and fabrication method

Method for fabricating a thin film inductor

Method for fabricating a thin film capacitor

Scaled adaptive lithography

Method for fabricating a thin film resistor

Patents Applicationslast 30 patents

Method and apparatus for fabricating waveguides and waveguides fabr...

Method and apparatus for fabricating waveguides and waveguides fabr...

Computerized systems and methods for the creation and sharing of pr...

Computerized systems and methods for acquiring and disseminating pr...

Apparatus, method and product therefrom, for aligning die to interc...

Computerized systems and methods for performing new product introdu...

High temperature circuit apparatus

Circuit chip package and fabrication method