TREA

Leu-Jen CHEN

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  • Taipei, TW
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Patents Grantslast 30 patents

  • Information Patent Grant

    Chip package structure
    • Patent number 10,985,125
    • Issue date Apr 20, 2021
    • Taiwan Semiconductor Manufacturing Co., Ltd
    • Kuan-Yu Huang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Chip package structure
    • Patent number 10,790,254
    • Issue date Sep 29, 2020
    • Taiwan Semiconductor Manufacturing Co., Ltd
    • Kuan-Yu Huang
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

  • Information Patent Application

    CHIP PACKAGE STRUCTURE
    • Publication number 20210005567
    • Publication date Jan 7, 2021
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Kuan-Yu HUANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CHIP PACKAGE STRUCTURE
    • Publication number 20190348386
    • Publication date Nov 14, 2019
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Kuan-Yu HUANG
    • H01 - BASIC ELECTRIC ELEMENTS