Lewis Chu

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Pingihen City, TW

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Patents Grantslast 30 patents

Information Patent Grant
SiP (system in package) design systems and methods
- Patent number 7,565,635
- Issue date Jul 21, 2009
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Clinton Chao
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
SIP (SYSTEM IN PACKAGE) DESIGN SYSTEMS AND METHODS
- Publication number 20080250182
- Publication date Oct 9, 2008
- Taiwan Semiconductor Manufacturing Co., LTD
- Clinton Chao
- G06 - COMPUTING CALCULATING COUNTING