Lewis D. Lipschutz

Person

Poughkeepsie, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Bonding method
- Patent number 4,805,831
- Issue date Feb 21, 1989
- International Business Machines Corporation
- Lewis D. Lipschutz
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding method and apparatus
- Patent number 4,747,533
- Issue date May 31, 1988
- International Business Machines Corporation
- Lewis D. Lipschutz
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for forming improved solder connections for semiconductor d...
- Patent number 4,611,746
- Issue date Sep 16, 1986
- International Business Machines Corporation
- Ernest N. Levine
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Directly sealed multi-chip module
- Patent number 4,500,945
- Issue date Feb 19, 1985
- International Business Machines Corporation
- Lewis D. Lipschutz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible thermal conduction element for cooling semiconductor devices
- Patent number 4,498,530
- Issue date Feb 12, 1985
- International Business Machines Corporation
- Lewis D. Lipschutz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Telescoping thermal conduction element for semiconductor devices
- Patent number 4,483,389
- Issue date Nov 20, 1984
- International Business Machines Corporation
- Demetrios Balderes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cooling element for solder bonded semiconductor devices
- Patent number 4,442,450
- Issue date Apr 10, 1984
- International Business Machines Corporation
- Lewis D. Lipschutz
- H01 - BASIC ELECTRIC ELEMENTS

Lewis D. Lipschutz

Person

Patents Grantslast 30 patents

Bonding method

Bonding method and apparatus

Process for forming improved solder connections for semiconductor d...

Directly sealed multi-chip module

Flexible thermal conduction element for cooling semiconductor devices

Telescoping thermal conduction element for semiconductor devices

Cooling element for solder bonded semiconductor devices