Lewis M. Eyman

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Austin, TX, US

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Patents Grantslast 30 patents

Information Patent Grant
Heat sink subassembly
- Patent number 6,639,800
- Issue date Oct 28, 2003
- Advanced Micro Devices, Inc.
- Lewis Michael Eyman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Removable heat transfer apparatus for a pin grid array (PGA) device...
- Patent number 6,504,243
- Issue date Jan 7, 2003
- Advanced Micro Devices, Inc.
- Anthony Andric
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Temperature sensor mounting for accurate measurement and durability
- Patent number 6,477,047
- Issue date Nov 5, 2002
- Advanced Micro Devices, Inc.
- Doug Markwardt
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Flip chip semiconductor devices and heat sink assemblies, and the c...
- Publication number 20030085453
- Publication date May 8, 2003
- Advance Micro Devices, Inc.
- Lewis M. Eyman
- H01 - BASIC ELECTRIC ELEMENTS