Lewis S. Goldmann

Person

Bedford, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Solder mold plates used in packaging process and method of manufact...
- Patent number 8,337,735
- Issue date Dec 25, 2012
- Ultratech, Inc.
- Lewis S Goldmann
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder mold plates used in packaging process and method of manufact...
- Patent number 8,132,775
- Issue date Mar 13, 2012
- International Business Machines Corporation
- Lewis S Goldmann
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and structure to control thermal gradients in semiconductor...
- Patent number 8,107,800
- Issue date Jan 31, 2012
- International Business Machines Corporation
- Raschid J. Bezama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compressible films surrounding solder connectors
- Patent number 7,566,649
- Issue date Jul 28, 2009
- International Business Machines Corporation
- William E. Bernier
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and structure to provide balanced mechanical loading of devi...
- Patent number 7,518,235
- Issue date Apr 14, 2009
- International Business Machines Corporation
- Patrick A. Coico
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC chip package having force-adjustable member between stiffener an...
- Patent number 7,443,026
- Issue date Oct 28, 2008
- International Business Machines Corporation
- Lewis S. Goldmann
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Compressible films surrounding solder connectors
- Patent number 7,332,821
- Issue date Feb 19, 2008
- International Business Machines Corporation
- William E. Bernier
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic module assembly
- Patent number 7,095,614
- Issue date Aug 22, 2006
- International Business Machines Corporation
- Lewis S. Goldmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus to form a reworkable seal on an electronic module
- Patent number 6,955,543
- Issue date Oct 18, 2005
- International Business Machines Corporation
- Gaetano P. Messina
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive polymer interconnection configurations
- Patent number 6,858,111
- Issue date Feb 22, 2005
- International Business Machines Corporation
- Charles H. Perry
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Full wafer test configuration using memory metals
- Patent number 6,724,203
- Issue date Apr 20, 2004
- International Business Machines Corporation
- Lewis S. Goldmann
- G01 - MEASURING TESTING
Information Patent Grant
Process for forming a multi-level thin-film electronic packaging st...
- Patent number 6,678,949
- Issue date Jan 20, 2004
- International Business Machines Corporation
- Chandrika Prasad
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Capping structure for electronics package undergoing compressive so...
- Patent number 6,462,271
- Issue date Oct 8, 2002
- International Business Machines Corporation
- Jeffrey T. Coffin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive adhesive interconnection with insulating polymer carrier
- Patent number 6,458,623
- Issue date Oct 1, 2002
- International Business Machines Corporation
- Lewis S. Goldmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with low stress hermetic seal
- Patent number 6,459,160
- Issue date Oct 1, 2002
- International Business Machines Corporation
- Lewis Sigmund Goldmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low stress hermetic seal
- Patent number 6,342,407
- Issue date Jan 29, 2002
- International Business Machines Corporation
- Lewis Sigmund Goldmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive polymer interconnection configurations
- Patent number 6,333,104
- Issue date Dec 25, 2001
- International Business Machines Corporation
- Charles H. Perry
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical interconnection package and method thereof
- Patent number 6,333,563
- Issue date Dec 25, 2001
- International Business Machines Corporation
- Raymond A. Jackson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
One step method for curing and joining BGA solder balls
- Patent number 6,333,209
- Issue date Dec 25, 2001
- International Business Machines Corporation
- Patrick A. Coico
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mechanical attachment means used as electrical connection
- Patent number 6,287,126
- Issue date Sep 11, 2001
- International Business Machines Corporation
- Michael Berger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-level thin-film electronic packaging structure and related me...
- Patent number 6,281,452
- Issue date Aug 28, 2001
- International Business Machines Corporation
- Chandrika Prasad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder disc connection
- Patent number 6,278,184
- Issue date Aug 21, 2001
- International Business Machines Corporation
- Peter J. Brofman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and materials for increasing the strength of crystalline cer...
- Patent number 6,258,191
- Issue date Jul 10, 2001
- International Business Machines Corporation
- Benjamin V. Fasano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder disc connection
- Patent number 6,253,986
- Issue date Jul 3, 2001
- International Business Machines Corporation
- Peter J. Brofman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder disc connection
- Patent number 6,070,321
- Issue date Jun 6, 2000
- International Business Machines Corporation
- Peter J. Brofman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Hermetic CBGA/CCGA structure with thermal paste cooling
- Patent number 5,990,418
- Issue date Nov 23, 1999
- International Business Machines Corporation
- Kevin G. Bivona
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cast metal seal for semiconductor substrates
- Patent number 5,982,038
- Issue date Nov 9, 1999
- International Business Machines Corporation
- Hilton T. Toy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic ball grid array using in-situ solder stretch
- Patent number 5,975,409
- Issue date Nov 2, 1999
- International Business Machines Corporation
- Peter J. Brofman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhanced ceramic ball grid array using in-situ solder stretch with...
- Patent number 5,968,670
- Issue date Oct 19, 1999
- International Business Machines Corporation
- Peter J. Brofman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Enhanced ceramic ball grid array using in-situ solder stretch with...
- Patent number 5,964,396
- Issue date Oct 12, 1999
- International Business Machines Corporation
- Peter J. Brofman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SOLDER MOLD PLATES USED IN PACKAGING PROCESS AND METHOD OF MANUFACT...
- Publication number 20120125556
- Publication date May 24, 2012
- International Business Machines Corporation
- LEWIS S. GOLDMANN
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER MOLD PLATES USED IN PACKAGING PROCESS AND METHOD OF MANUFACT...
- Publication number 20090266972
- Publication date Oct 29, 2009
- International Business Machines Corporation
- LEWIS S. GOLDMANN
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND STRUCTURE TO CONTROL THERMAL GRADIENTS IN SEMICONDUCTOR...
- Publication number 20090175606
- Publication date Jul 9, 2009
- International Business Machines Corporation
- Raschid J. Bezama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC CHIP PACKAGE HAVING FORCE-ADJUSTABLE MEMBER BETWEEN STIFFENER AN...
- Publication number 20080123311
- Publication date May 29, 2008
- International Business Machines Corporation
- Lewis S. Goldmann
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPRESSIBLE FILMS SURROUNDING SOLDER CONNECTORS
- Publication number 20080009101
- Publication date Jan 10, 2008
- William E. Bernier
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
METHOD AND STRUCTURE TO PROVIDE BALANCED MECHANICAL LOADING OF DEVI...
- Publication number 20060202325
- Publication date Sep 14, 2006
- International Business Machines Corporation
- Patrick A. Coico
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPRESSIBLE FILMS SURROUNDING SOLDER CONNECTORS
- Publication number 20060040567
- Publication date Feb 23, 2006
- International Business Machines Corporation
- William E. Bernier
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
ELECTRONIC MODULE ASSEMBLY
- Publication number 20050231918
- Publication date Oct 20, 2005
- International Business Machines Corporation
- Lewis S. Goldmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS TO FORM A REWORKABLE SEAL ON AN ELECTRONIC MODULE
- Publication number 20050037640
- Publication date Feb 17, 2005
- International Business Machines Corporation
- Gaetano P. Messina
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stress resistant land grid array (LGA) module and method of forming...
- Publication number 20040141296
- Publication date Jul 22, 2004
- Patrick Anthony Coico
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Conductive adhesive interconnection with insulating polymer carrier
- Publication number 20020093104
- Publication date Jul 18, 2002
- International Business Machines Corporation
- Lewis S. Goldmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package with low stress hermetic seal
- Publication number 20020090761
- Publication date Jul 11, 2002
- Lewis Sigmund Goldmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Capping structure for electronics package undergoing compressive so...
- Publication number 20020079117
- Publication date Jun 27, 2002
- International Business Machines Corporation
- Jeffrey T. Coffin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stress resistant land grid array (LGA) module and method of forming...
- Publication number 20020050398
- Publication date May 2, 2002
- Patrick Anthony Coico
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Process for forming a multi-level thin-film electronic packaging st...
- Publication number 20010037565
- Publication date Nov 8, 2001
- Chandrika Prasad
- H01 - BASIC ELECTRIC ELEMENTS

Lewis S. Goldmann

Person

Patents Grantslast 30 patents

Solder mold plates used in packaging process and method of manufact...

Solder mold plates used in packaging process and method of manufact...

Method and structure to control thermal gradients in semiconductor...

Compressible films surrounding solder connectors

Method and structure to provide balanced mechanical loading of devi...

IC chip package having force-adjustable member between stiffener an...

Compressible films surrounding solder connectors

Electronic module assembly

Method and apparatus to form a reworkable seal on an electronic module

Conductive polymer interconnection configurations

Full wafer test configuration using memory metals

Process for forming a multi-level thin-film electronic packaging st...

Capping structure for electronics package undergoing compressive so...

Conductive adhesive interconnection with insulating polymer carrier

Package with low stress hermetic seal

Low stress hermetic seal

Conductive polymer interconnection configurations

Electrical interconnection package and method thereof

One step method for curing and joining BGA solder balls

Mechanical attachment means used as electrical connection

Multi-level thin-film electronic packaging structure and related me...

Solder disc connection

Method and materials for increasing the strength of crystalline cer...

Solder disc connection

Solder disc connection

Hermetic CBGA/CCGA structure with thermal paste cooling

Cast metal seal for semiconductor substrates

Ceramic ball grid array using in-situ solder stretch

Enhanced ceramic ball grid array using in-situ solder stretch with...

Enhanced ceramic ball grid array using in-situ solder stretch with...

Patents Applicationslast 30 patents

SOLDER MOLD PLATES USED IN PACKAGING PROCESS AND METHOD OF MANUFACT...

SOLDER MOLD PLATES USED IN PACKAGING PROCESS AND METHOD OF MANUFACT...

METHOD AND STRUCTURE TO CONTROL THERMAL GRADIENTS IN SEMICONDUCTOR...

IC CHIP PACKAGE HAVING FORCE-ADJUSTABLE MEMBER BETWEEN STIFFENER AN...

COMPRESSIBLE FILMS SURROUNDING SOLDER CONNECTORS

METHOD AND STRUCTURE TO PROVIDE BALANCED MECHANICAL LOADING OF DEVI...

COMPRESSIBLE FILMS SURROUNDING SOLDER CONNECTORS

ELECTRONIC MODULE ASSEMBLY

METHOD AND APPARATUS TO FORM A REWORKABLE SEAL ON AN ELECTRONIC MODULE

Stress resistant land grid array (LGA) module and method of forming...

Conductive adhesive interconnection with insulating polymer carrier

Package with low stress hermetic seal

Capping structure for electronics package undergoing compressive so...

Stress resistant land grid array (LGA) module and method of forming...

Process for forming a multi-level thin-film electronic packaging st...