Li-Anne Liew

Person

  • Westminster, CO, US

Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    MICROPILLAR-ENABLED THERMAL GROUND PLANE

    • Publication number 20230332841
    • Publication date Oct 19, 2023
    • KELVIN THERMAL TECHNOLOGIES, INC.
    • Ryan John Lewis
    • F28 - HEAT EXCHANGE IN GENERAL
  • Information Patent Application

    POLYMER-BASED MICROFABRICATED THERMAL GROUND PLANE

    • Publication number 20220155025
    • Publication date May 19, 2022
    • KELVIN THERMAL TECHNOLOGIES, INC.
    • Ryan John Lewis
    • B81 - MICRO-STRUCTURAL TECHNOLOGY
  • Information Patent Application

    MICROPILLAR-ENABLED THERMAL GROUND PLANE

    • Publication number 20200300563
    • Publication date Sep 24, 2020
    • KELVIN THERMAL TECHNOLOGIES, INC.
    • Ryan John Lewis
    • F28 - HEAT EXCHANGE IN GENERAL
  • Information Patent Application

    POLYMER-BASED MICROFABRICATED THERMAL GROUND PLANE

    • Publication number 20190390919
    • Publication date Dec 26, 2019
    • KELVIN THERMAL TECHNOLOGIES, INC.
    • Ryan John Lewis
    • B81 - MICRO-STRUCTURAL TECHNOLOGY
  • Information Patent Application

    POLYMER-BASED MICROFABRICATED THERMAL GROUND PLANE

    • Publication number 20160161193
    • Publication date Jun 9, 2016
    • KELVIN THERMAL TECHNOLOGIES, INC.
    • Ryan John Lewis
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Application

    MICROPILLAR-ENABLED THERMAL GROUND PLANE

    • Publication number 20160076820
    • Publication date Mar 17, 2016
    • The Regents of the University of Colorado, a Body Corporate
    • Ryan John Lewis
    • F28 - HEAT EXCHANGE IN GENERAL
  • Information Patent Application

    VACUUM-ENHANCED HEAT SPREADER

    • Publication number 20160081227
    • Publication date Mar 17, 2016
    • The Regents of the University of Colorado, a Body Corporate
    • Yung-Cheng Lee
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR