Li-Cheng Tai

Person

Kaohsiung, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device package and method of manufacturing the same
- Patent number 11,791,280
- Issue date Oct 17, 2023
- Advanced Semiconductor Engineering, Inc.
- Li-Hua Tai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package
- Patent number 11,637,055
- Issue date Apr 25, 2023
- Advanced Semiconductor Engineering, Inc.
- Li-Hua Tai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and method of manufacturing the same
- Patent number 11,177,221
- Issue date Nov 16, 2021
- Advanced Semiconductor Engineering, Inc.
- Li-Hua Tai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and method of manufacturing the same
- Patent number 11,107,774
- Issue date Aug 31, 2021
- Advanced Semiconductor Engineering, Inc.
- Li-Hua Tai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming bumps on under bump metallurgy
- Patent number 7,816,252
- Issue date Oct 19, 2010
- Advanced Semiconductor Engineering, Inc.
- Jui I Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate process for an embedded component
- Patent number 7,727,818
- Issue date Jun 1, 2010
- Advanced Semiconductor Engineering, Inc.
- Chueh-An Hsieh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bumping process and structure thereof
- Patent number 7,651,937
- Issue date Jan 26, 2010
- Advanced Semiconductor Engineering, Inc.
- Chueh-An Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming bumps
- Patent number 7,541,273
- Issue date Jun 2, 2009
- Advanced Semiconductor Engineering, Inc.
- Chueh-An Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer structure with a multi-layer barrier in an UBM layer network...
- Patent number 7,518,241
- Issue date Apr 14, 2009
- Advanced Semiconductor Engineering Inc.
- Li-Cheng Tai
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20220037244
- Publication date Feb 3, 2022
- Advanced Semiconductor Engineering, Inc.
- Li-Hua TAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210391278
- Publication date Dec 16, 2021
- Advanced Semiconductor Engineering, Inc.
- Li-Hua TAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210118806
- Publication date Apr 22, 2021
- Advanced Semiconductor Engineering, Inc.
- Li-Hua TAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20200335452
- Publication date Oct 22, 2020
- Advanced Semiconductor Engineering, Inc.
- Li-Hua TAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING BUMPS ON UNDER BUMP METALLURGY
- Publication number 20090061614
- Publication date Mar 5, 2009
- Advanced Semiconductor Engineering, Inc.
- Jui I. YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Substrate process for an embedded component
- Publication number 20080220566
- Publication date Sep 11, 2008
- Chueh-An Hsieh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Flip chip package and manufacturing method of the same
- Publication number 20070120269
- Publication date May 31, 2007
- Advanced Semiconductor Engineering, Inc.
- Chueh-An Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip structure and manufacturing method of the same
- Publication number 20070108612
- Publication date May 17, 2007
- Advanced Semiconductor Engineering, Inc.
- Chueh-An Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING BUMPS
- Publication number 20070087548
- Publication date Apr 19, 2007
- Chueh-An Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bumping process and structure thereof
- Publication number 20070049001
- Publication date Mar 1, 2007
- Advanced Semiconductor Engineering, Inc.
- Chueh-An Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer structure
- Publication number 20070045848
- Publication date Mar 1, 2007
- Advanced Semiconductor Engineering, Inc.
- Li-Cheng Tai
- H01 - BASIC ELECTRIC ELEMENTS

Li-Cheng Tai

Person

Patents Grantslast 30 patents

Semiconductor device package and method of manufacturing the same

Semiconductor device package

Semiconductor device package and method of manufacturing the same

Semiconductor device package and method of manufacturing the same

Method for forming bumps on under bump metallurgy

Substrate process for an embedded component

Bumping process and structure thereof

Method for forming bumps

Wafer structure with a multi-layer barrier in an UBM layer network...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

METHOD FOR FORMING BUMPS ON UNDER BUMP METALLURGY

Substrate process for an embedded component

Flip chip package and manufacturing method of the same

Chip structure and manufacturing method of the same

METHOD FOR FORMING BUMPS

Bumping process and structure thereof

Wafer structure